具有高速电子和光子功能的硅集成电路芯片级密封封装

{"title":"具有高速电子和光子功能的硅集成电路芯片级密封封装","authors":"Mikko Karppinen, Mikko T. Harjanne, Noora Heinilehto, Jae-Wung Lee, J. Ollila, Jaska Paaso","doi":"10.1117/12.3006559","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":517898,"journal":{"name":"Optical Interconnects XXIV","volume":"30 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Chip-scale hermetic packaging of Si PIC with high-speed electronics and photonics\",\"authors\":\"Mikko Karppinen, Mikko T. Harjanne, Noora Heinilehto, Jae-Wung Lee, J. Ollila, Jaska Paaso\",\"doi\":\"10.1117/12.3006559\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":517898,\"journal\":{\"name\":\"Optical Interconnects XXIV\",\"volume\":\"30 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optical Interconnects XXIV\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.3006559\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Interconnects XXIV","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.3006559","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}