设计基于缺陷接地结构 (DGS) 的增强型宽带微带贴片天线,用于 6 GHz 以下频率应用

Mohamed Lemine El Issawi, Dominic Konditi, AD Usman
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引用次数: 0

摘要

本文对三种不同的微带贴片天线 (MPA) 设计进行了全面的比较研究,每种设计都针对 6 GHz 以下的应用进行了优化。最初的设计阶段采用了罗杰斯 RT 5880 衬底,其介电常数(εr1)为 2.2,厚度(H1)为 1.42 毫米。所提出的模型实现了 4.8 至 7 GHz 的共振频段,带宽为 2.2 GHz,回波损耗 (S11) 为 -20 dB。随后的改进包括集成钛酸锶钡 (BST) 薄膜(εr2 = 250,厚度(H2) = 0.005 mm),有效地将工作频带转移到 3.5-5.3 GHz。最终的迭代设计同时采用了 BST 和缺陷接地结构 (DGS),是一项重大进步,实现了从 1.8 到 6 GHz 的宽带工作,将带宽扩展到 4.2 GHz,并将 S11 提高到 -25 dB。这种集成还实现了 30 x 26.5 x 1.42 mm³ 的紧凑型天线尺寸。这些发现强调了 BST 和 DGS 在增强 MPA 设计方面的协同作用,标志着天线技术的重大进步,对一系列无线通信至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of Enhanced Wide Band Microstrip Patch Antenna Based on Defected Ground Structures (DGS) for Sub-6 GHz Applications
In this paper a comprehensive comparative study of three distinct microstrip patch antenna (MPA) designs, each optimized for the sub-6 GHz applications, is presented. The initial design phase utilized a Rogers RT 5880 substrate with a permittivity (εr1) of 2.2 and a thickness(H1) of 1.42 mm. The proposed model achieved a resonance band ranging from 4.8 to 7 GHz, with a bandwidth of 2.2 GHz and a return loss (S11) of -20 dB. Subsequent enhancements involved integrating a Barium Strontium Titanate (BST) thin film (εr2 = 250, thickness(H2) = 0.005 mm), effectively shifting the operational band to 3.5-5.3 GHz. The final design iteration, which incorporated both BST and a Defective Ground Structure (DGS), represented a substantial advancement, achieving wideband operation from 1.8 to 6 GHz, expanding the bandwidth to 4.2 GHz, and improving the S11 to -25 dB. This integration also resulted in a compact antenna size of 30 x 26.5 x 1.42 mm³. These findings underscore the synergistic impact of BST and DGS in enhancing MPA design, marking a significant progression in antenna technology, vital for a range of wireless communication.
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