研究包覆导体的 XLPE 复合绝缘层因热老化引起的介电性能和结构变化

Mehti Camalov, Elmir Bagirli, Khikmat Aliyev
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引用次数: 0

摘要

XLPE 复合材料通常用于包覆导体的绝缘,研究 XLPE 复合材料的介电特性和结构变化是一项关键的研究重点。在本研究中,我们研究了 XLPE 绝缘层热老化对介电损耗(tanδ)在频率和电压方面的影响。为此,样品在 120°C 下进行了六次老化,共计 450 小时。此外,我们还在老化过程前后对绝缘材料进行了 PD 测试、傅立叶变换红外光谱和扫描电镜评估。通过比较 PD 测试结果和 tanδ 测量值,我们对材料在热老化过程中的性能变化进行了全面分析。为了更深入地解释热老化导致的这些结果,我们利用傅立叶变换红外光谱和扫描电镜技术探讨了直接影响 tanδ 和 PD 值的内部和表面结构变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of Dielectric Properties and Structural Changes in XLPE Composite Insulation of Covered Conductor due to Thermal Aging
Investigating the dielectric characteristics and structural alterations in XLPE composites, commonly employed in the insulation of covered conductors, stands as a pivotal research focus. In this study, we examined the variation in dielectric loss (tanδ) concerning frequency and voltage, influenced by thermal aging in XLPE insulation. To achieve this, the samples underwent aging at 120°C for six periods, a total of 450 hours. Furthermore, we conducted PD tests, FTIR, and SEM assessments on the insulation both before and after the aging process. A comprehensive analysis of the material's property changes during thermal aging was performed by comparing the PD test results with the tanδ measurements. In order to delve deeper into the interpretation of these findings because of thermal aging, we explored both internal and surface structural modifications, which directly impact tanδ and PD values, utilizing FTIR and SEM techniques.
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