{"title":"使用晶圆级封装的薄型应变传感器加工工艺。","authors":"Takanori Aono, Masatoshi Kanamaru, H. Ikeda","doi":"10.1541/ieejsmas.144.56","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":53412,"journal":{"name":"IEEJ Transactions on Sensors and Micromachines","volume":"27 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"ウエハレベルパッケージングを利用した薄型ひずみセンサの加工プロセス\",\"authors\":\"Takanori Aono, Masatoshi Kanamaru, H. Ikeda\",\"doi\":\"10.1541/ieejsmas.144.56\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":53412,\"journal\":{\"name\":\"IEEJ Transactions on Sensors and Micromachines\",\"volume\":\"27 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEJ Transactions on Sensors and Micromachines\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1541/ieejsmas.144.56\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEJ Transactions on Sensors and Micromachines","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1541/ieejsmas.144.56","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}