{"title":"测量用压敏胶粘合在曲面粘合剂上的薄片的剥离强度并通过有限元分析预测剥离阻力的实验方法","authors":"Akihiro Maesaka, Yushin Kakei, Tsutomu Osaka, Yoshihiro Kudo, Yu Sekiguchi, Chiaki Sato","doi":"10.1080/00218464.2024.2334340","DOIUrl":null,"url":null,"abstract":"To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...","PeriodicalId":501232,"journal":{"name":"The Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis\",\"authors\":\"Akihiro Maesaka, Yushin Kakei, Tsutomu Osaka, Yoshihiro Kudo, Yu Sekiguchi, Chiaki Sato\",\"doi\":\"10.1080/00218464.2024.2334340\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...\",\"PeriodicalId\":501232,\"journal\":{\"name\":\"The Journal of Adhesion\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Journal of Adhesion\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/00218464.2024.2334340\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Adhesion","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00218464.2024.2334340","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis
To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...
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