基于面波通信的波导设计问题,适用于凸点间距为 1.2 毫米及以上的基于倒装芯片封装的集成电路

Q3 Engineering
Mahaveer Penna, Jijesh J J
{"title":"基于面波通信的波导设计问题,适用于凸点间距为 1.2 毫米及以上的基于倒装芯片封装的集成电路","authors":"Mahaveer Penna, Jijesh J J","doi":"10.1080/1448837x.2024.2323878","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":34935,"journal":{"name":"Australian Journal of Electrical and Electronics Engineering","volume":"68 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Surface wave communication-based wave guide design concerns for flip chip package-based integrated circuits with bump pitch sizes of 1.2 mm and above\",\"authors\":\"Mahaveer Penna, Jijesh J J\",\"doi\":\"10.1080/1448837x.2024.2323878\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":34935,\"journal\":{\"name\":\"Australian Journal of Electrical and Electronics Engineering\",\"volume\":\"68 3\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Australian Journal of Electrical and Electronics Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/1448837x.2024.2323878\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Australian Journal of Electrical and Electronics Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/1448837x.2024.2323878","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

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Surface wave communication-based wave guide design concerns for flip chip package-based integrated circuits with bump pitch sizes of 1.2 mm and above
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来源期刊
Australian Journal of Electrical and Electronics Engineering
Australian Journal of Electrical and Electronics Engineering Engineering-Electrical and Electronic Engineering
CiteScore
2.30
自引率
0.00%
发文量
46
期刊介绍: Engineers Australia journal and conference papers.
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