占空比对脉冲电流电镀法生产的 Ni-P 涂层磷含量和硬度的影响

Panya Wintachai, Nujira Kothanam, Komsak Harachai, N. Triroj, P. Jaroenapibal
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引用次数: 0

摘要

采用脉冲电沉积法在低碳钢基底上制备了 Ni-P 涂层。研究了脉冲占空比对 Ni-P 涂层磷含量和硬度的影响。扫描电子显微镜(SEM)和能量色散 X 射线光谱(EDS)用于检测 Ni-P 涂层的表面形貌和化学成分。结果表明,脉冲占空比(20% - 80%)的增加导致磷含量从 17.81 wt.% 降至 13.71 wt.%。显微硬度值与磷含量呈反比关系。占空比为 80% 的样品硬度最高,为 538.22 ± 12.92 HV0.1,磷含量最低,为 13.71 wt.%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Duty Cycle on the Phosphorus Content and Hardness of the Ni-P Coatings Produced by Pulse-Current Electroplating
Ni-P coatings were prepared on low carbon steel substrates using the pulse electrodeposition method. The influence of the pulse duty cycle on the phosphorus content and hardness of the Ni-P coatings was investigated. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were employed to examine the surface morphology and chemical composition of the Ni-P coating layers. The results showed that an increased pulse duty cycle (20% - 80%) led to a decreased phosphorus content from 17.81 wt.% to 13.71 wt.%. The microhardness values were found to have an inverse relationship with the phosphorus content. The highest hardness of 538.22 ± 12.92 HV0.1 was obtained from the sample produced with a duty cycle of 80%, which had the lowest P content of 13.71 wt.%.
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