混合三维集成环形硅光子电子收发器的热建模（勘误表）

{"title":"混合三维集成环形硅光子电子收发器的热建模（勘误表）","authors":"David Coenen, Minkyu Kim, H. Oprins, Y. Ban, Dimitrios Velenis, J. Van Campenhout, Ingrid De Wolf","doi":"10.1117/1.jom.4.1.019801","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":127363,"journal":{"name":"Journal of Optical Microsystems","volume":"41 23","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)\",\"authors\":\"David Coenen, Minkyu Kim, H. Oprins, Y. Ban, Dimitrios Velenis, J. Van Campenhout, Ingrid De Wolf\",\"doi\":\"10.1117/1.jom.4.1.019801\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":127363,\"journal\":{\"name\":\"Journal of Optical Microsystems\",\"volume\":\"41 23\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Optical Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/1.jom.4.1.019801\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Optical Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/1.jom.4.1.019801","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}