Shih-Feng Tseng, Guan-Lin Chen, Chien-Yao Huang, Donyau Chiang, Chil-Chyuan Kuo
{"title":"研究光纤激光器与 Si3N4 片材之间的相互作用,利用多环策略钻凿方形微孔","authors":"Shih-Feng Tseng, Guan-Lin Chen, Chien-Yao Huang, Donyau Chiang, Chil-Chyuan Kuo","doi":"10.1007/s00170-024-13383-4","DOIUrl":null,"url":null,"abstract":"<p>A high pulsed fiber laser was utilized to drill square microholes in Si<sub>3</sub>N<sub>4</sub> sheets in an atmospheric environment. Various processing parameters including scan spacing, number of scan passes, and number of multi-ring paths with a multi-ring strategy were adjusted to laser-drill Si<sub>3</sub>N<sub>4</sub> sheets. The geometric characteristics of laser-drilled square microholes with shoulder height, taper angle, and corner radius were measured using a laser scanning microscope. X-ray diffraction was applied to examine the residual stress of the Si<sub>3</sub>N<sub>4</sub> sheets before and after laser drilling. Moreover, the heat-affected zone and element content were examined using a scanning electron microscope. The experimental results exhibited that the optimal shoulder height of the square microhole drilled with the multi-ring strategy was 6.67 ± 0.21 μm, which was approximately 77% lower than that of 29.05 ± 10.95 μm for the square microhole drilled with the single-ring strategy. Moreover, the residual stresses of the original Si<sub>3</sub>N<sub>4</sub> sheet and the square microholes laser-drilled by single-ring and multi-ring strategies were − 181.2 ± 41, 164.5 ± 31.9, and 104.6 ± 7.8 MPa, respectively. The proposed laser drilling technology with the multi-ring strategy can be widely used in the semiconductor industry for probe cards.</p>","PeriodicalId":50345,"journal":{"name":"International Journal of Advanced Manufacturing Technology","volume":"2016 1","pages":""},"PeriodicalIF":2.9000,"publicationDate":"2024-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation of interactions between fiber lasers and Si3N4 sheets for drilling square microholes with multi-ring strategy\",\"authors\":\"Shih-Feng Tseng, Guan-Lin Chen, Chien-Yao Huang, Donyau Chiang, Chil-Chyuan Kuo\",\"doi\":\"10.1007/s00170-024-13383-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>A high pulsed fiber laser was utilized to drill square microholes in Si<sub>3</sub>N<sub>4</sub> sheets in an atmospheric environment. Various processing parameters including scan spacing, number of scan passes, and number of multi-ring paths with a multi-ring strategy were adjusted to laser-drill Si<sub>3</sub>N<sub>4</sub> sheets. The geometric characteristics of laser-drilled square microholes with shoulder height, taper angle, and corner radius were measured using a laser scanning microscope. X-ray diffraction was applied to examine the residual stress of the Si<sub>3</sub>N<sub>4</sub> sheets before and after laser drilling. Moreover, the heat-affected zone and element content were examined using a scanning electron microscope. The experimental results exhibited that the optimal shoulder height of the square microhole drilled with the multi-ring strategy was 6.67 ± 0.21 μm, which was approximately 77% lower than that of 29.05 ± 10.95 μm for the square microhole drilled with the single-ring strategy. Moreover, the residual stresses of the original Si<sub>3</sub>N<sub>4</sub> sheet and the square microholes laser-drilled by single-ring and multi-ring strategies were − 181.2 ± 41, 164.5 ± 31.9, and 104.6 ± 7.8 MPa, respectively. The proposed laser drilling technology with the multi-ring strategy can be widely used in the semiconductor industry for probe cards.</p>\",\"PeriodicalId\":50345,\"journal\":{\"name\":\"International Journal of Advanced Manufacturing Technology\",\"volume\":\"2016 1\",\"pages\":\"\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-03-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Advanced Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s00170-024-13383-4\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"AUTOMATION & CONTROL SYSTEMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Advanced Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s00170-024-13383-4","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
Investigation of interactions between fiber lasers and Si3N4 sheets for drilling square microholes with multi-ring strategy
A high pulsed fiber laser was utilized to drill square microholes in Si3N4 sheets in an atmospheric environment. Various processing parameters including scan spacing, number of scan passes, and number of multi-ring paths with a multi-ring strategy were adjusted to laser-drill Si3N4 sheets. The geometric characteristics of laser-drilled square microholes with shoulder height, taper angle, and corner radius were measured using a laser scanning microscope. X-ray diffraction was applied to examine the residual stress of the Si3N4 sheets before and after laser drilling. Moreover, the heat-affected zone and element content were examined using a scanning electron microscope. The experimental results exhibited that the optimal shoulder height of the square microhole drilled with the multi-ring strategy was 6.67 ± 0.21 μm, which was approximately 77% lower than that of 29.05 ± 10.95 μm for the square microhole drilled with the single-ring strategy. Moreover, the residual stresses of the original Si3N4 sheet and the square microholes laser-drilled by single-ring and multi-ring strategies were − 181.2 ± 41, 164.5 ± 31.9, and 104.6 ± 7.8 MPa, respectively. The proposed laser drilling technology with the multi-ring strategy can be widely used in the semiconductor industry for probe cards.
期刊介绍:
The International Journal of Advanced Manufacturing Technology bridges the gap between pure research journals and the more practical publications on advanced manufacturing and systems. It therefore provides an outstanding forum for papers covering applications-based research topics relevant to manufacturing processes, machines and process integration.