以高粉末流动率在不锈钢上激光金属沉积钛,实现高界面强度

IF 2.6 3区 材料科学 Q2 ENGINEERING, MANUFACTURING
Di Cui, Akash Aggarwal, Marc Leparoux
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引用次数: 0

摘要

由于钛和不锈钢 316 L 在混合区形成脆性金属间化合物 FeTi 和 Fe2Ti,以及热膨胀系数不匹配引起的高残余应力,因此直接连接具有强界面的钛和不锈钢 316 L 非常具有挑战性。在这项双金属定向能沉积研究中,首先使用传统的工艺参数机制在不锈钢上沉积钛,以了解界面开裂的易发性,然后提出了一种新颖的高粉末流动率方法,用于控制稀释和约束在界面上形成的金属间相。此外,还研究了高温基底预热(520 °C)对开裂敏感性和界面强度的影响。利用光学显微镜、扫描电子显微镜和能量色散 X 射线光谱对沉积的 Ti 样品及其与 316 L 基体的界面进行了表征,以研究与裂纹相关的几何形状、微观结构和化学成分。钛在不锈钢 316 L 上的高粉末流速沉积导致了极薄的稀释区(基底中约 10 μm 的熔池深度),限制了金属间相和裂纹的形成。无裂纹样品界面的极限剪切强度是通过测量立方体沉积物测得的,测得的最高强度为 381 ± 24 兆帕,超过了较弱的纯钛基材。高粉末流速沉积的高界面强度是由于飞行中的粉末流对激光束产生了大量衰减和阴影,这一点已通过高速成像得到证实,从而导致稀释区域极小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Laser metal deposition of titanium on stainless steel with high powder flowrate for high interfacial strength

Laser metal deposition of titanium on stainless steel with high powder flowrate for high interfacial strength

Direct joining of titanium and stainless steel 316 L with a strong interface is very challenging due to the formation of the brittle intermetallic compounds FeTi and Fe2Ti in the intermixing zones and to the high residual stress induced by the mismatch of the thermal expansion coefficients. In this bimetallic directed energy deposition study, firstly, deposition of Ti on stainless steel was carried out using conventional process parameter regime to understand the interfacial cracking susceptibility and then a novel high powder flowrate approach is proposed for controlling the dilution and constraining the intermetallic phases forming at the interface. The influence of high temperature substrate preheating (520 °C) on the cracking susceptibility and interface strength was also investigated. The deposited Ti samples and their interfaces with the 316 L substrate were characterized with optical microscopy, scanning electron microscopy and energy dispersive X-ray spectroscopy to investigate the geometry, microstructures and chemical compositions in relation to the cracks. The high powder flowrate deposition of Ti on stainless steel 316 L results in an extremely thin dilution region (~ 10 μm melt pool depth in the substrate) restricting the formation of the intermetallic phases and cracks. The ultimate shear strength of the interfaces of the crack free sample was measured from cuboid deposits and the highest measured strength is 381 ± 24 MPa, exceeding the weaker base material pure Ti. The high interfacial strength for high powder flowrate deposition is due to the substantial attenuation and shadowing of the laser beam by the in-flight powder stream as demonstrated by the high-speed imaging resulting in an extremely small dilution region.

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来源期刊
International Journal of Material Forming
International Journal of Material Forming ENGINEERING, MANUFACTURING-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
5.10
自引率
4.20%
发文量
76
审稿时长
>12 weeks
期刊介绍: The Journal publishes and disseminates original research in the field of material forming. The research should constitute major achievements in the understanding, modeling or simulation of material forming processes. In this respect ‘forming’ implies a deliberate deformation of material. The journal establishes a platform of communication between engineers and scientists, covering all forming processes, including sheet forming, bulk forming, powder forming, forming in near-melt conditions (injection moulding, thixoforming, film blowing etc.), micro-forming, hydro-forming, thermo-forming, incremental forming etc. Other manufacturing technologies like machining and cutting can be included if the focus of the work is on plastic deformations. All materials (metals, ceramics, polymers, composites, glass, wood, fibre reinforced materials, materials in food processing, biomaterials, nano-materials, shape memory alloys etc.) and approaches (micro-macro modelling, thermo-mechanical modelling, numerical simulation including new and advanced numerical strategies, experimental analysis, inverse analysis, model identification, optimization, design and control of forming tools and machines, wear and friction, mechanical behavior and formability of materials etc.) are concerned.
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