Alternate deposition and remelting microdroplets via single laser for printing low-defect and high-performance metal micropillars

Laser-induced forward transfer (LIFT) has emerged as a versatile technique for printing high-resolution metal microstructures. However, a common drawback of this method is the inadequate coalescence of the deposited metal microdroplets, which results in inferior electrical and mechanical properties. This paper proposes a novel approach for fabricating high-performance metal micropillars using a single-pulsed laser to alternately deposit and remelt metal microdroplets. Specifically, an ultraviolet nanosecond laser was used to induce the deposition of copper microdroplets, forming a patterned powder bed with high resolution. Subsequently, a laser pulse train was applied to fuse the patterned powder bed. The results showed that voids and microdroplet delamination were eliminated in the printed copper micropillars, whose yield strength and elastic modulus increased threefold, approaching 63% of those of the bulk metal. The remelting behavior of the deposited microdroplets was elucidated by modelling and analysing the thermal accumulation effects of a laser pulse train. A remelting map was proposed, including the non-melting, remelting, and vaporizing regimes. According to the depth of melt pool, the evolutions of morphology and microstructure in the depositing and remelting process were elucidated. Hence, this study advances the LIFT process for fabricating high-performance metal microstructures.