相间类型和厚度对 C/SiC 复合材料界面特性和拉伸损伤演变的影响

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Longbiao Li, Kang Su, Zhaoke Chen, Zhongwei Zhang, Xiang Xiong
{"title":"相间类型和厚度对 C/SiC 复合材料界面特性和拉伸损伤演变的影响","authors":"Longbiao Li, Kang Su, Zhaoke Chen, Zhongwei Zhang, Xiang Xiong","doi":"10.1177/14644207241234395","DOIUrl":null,"url":null,"abstract":"In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.","PeriodicalId":20630,"journal":{"name":"Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications","volume":"3 1","pages":""},"PeriodicalIF":2.5000,"publicationDate":"2024-02-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of interphase type and thickness on the interface properties and tensile damage evolution of C/SiC composites\",\"authors\":\"Longbiao Li, Kang Su, Zhaoke Chen, Zhongwei Zhang, Xiang Xiong\",\"doi\":\"10.1177/14644207241234395\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.\",\"PeriodicalId\":20630,\"journal\":{\"name\":\"Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications\",\"volume\":\"3 1\",\"pages\":\"\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2024-02-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1177/14644207241234395\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1177/14644207241234395","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

摘要

本文研究了在循环加载/卸载拉伸条件下,相间类型(即单相(PyC)和共沉积(PyC+SiC))和厚度(即 300、600、1000 和 2000 nm)对 mini-C/SiC 复合材料界面性能和损伤演化的影响。采用微机械构成模型推导了反切线模量(ITM)的损伤参数,并进行了滞后分析,以估算具有较大脱粘能量的微型 C/SiC 复合材料的界面特性。针对不同的相间类型和厚度,分析了 ITM 在卸载或重载应力作用下的实验损伤演变。通过滞后分析获得了界面特性(如界面脱粘应力和界面脱粘能量)。建立了加载/卸载 ITM、界面特性以及相间类型和厚度之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of interphase type and thickness on the interface properties and tensile damage evolution of C/SiC composites
In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
4.70
自引率
8.30%
发文量
166
审稿时长
3 months
期刊介绍: The Journal of Materials: Design and Applications covers the usage and design of materials for application in an engineering context. The materials covered include metals, ceramics, and composites, as well as engineering polymers. "The Journal of Materials Design and Applications is dedicated to publishing papers of the highest quality, in a timely fashion, covering a variety of important areas in materials technology. The Journal''s publishers have a wealth of publishing expertise and ensure that authors are given exemplary service. Every attention is given to publishing the papers as quickly as possible. The Journal has an excellent international reputation, with a corresponding international Editorial Board from a large number of different materials areas and disciplines advising the Editor." Professor Bill Banks - University of Strathclyde, UK This journal is a member of the Committee on Publication Ethics (COPE).
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信