多孔介质中平衡孔隙/孔洞在远应力作用下的弹性相互作用

IF 2.5 4区 工程技术 Q2 ENGINEERING, MECHANICAL
Kostas Davanas
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引用次数: 0

摘要

实际上,多孔介质的所有特性(弹性模量、热导率、电阻率等)都会随其孔隙度的变化而发生显著的非线性变化。除其他原因外,这可能是由于外加应力产生的弹性场引起的孔隙间相互作用。这些相互作用的性质存在争议--孔隙之间是吸引还是排斥--从而阻碍了对此类性质变化的估计。本文提供了一个数值解决方案,摒弃了以往模型的缺点,明确显示在具有平衡孔隙(即孔隙不对周围基体施加任何应力)的外部应力材料中,上述相互作用是排斥性的,并且(近似)与孔隙间距的 4 次方成反比。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ELASTIC INTERACTIONS BETWEEN EQUILIBRIUM PORES/HOLES IN POROUS MEDIA UNDER REMOTE STRESS
Practically all properties of porous media (elastic moduli, thermal conductivity, electrical resistivity, etc.) are subject to potentially significant and non-linear variations w.r.t. the degree of their porosity. This may be due, among other reasons, to the pore-to-pore interactions which stem from the elastic fields arising from the applied stresses. The nature of these interactions is disputed – whether they are attractive or repulsive among the pores – thus hindering the estimations about such property variations. Herein, a numerical solution is provided, devoid of the shortcomings of the previous models, showing unequivocally that in an externally stressed material with equilibrium pores (i.e. pores non-exerting any stresses on the surrounding matrix), the aforementioned interactions are repulsive, and (approximately) inversely proportional to the 4th power of the inter-pore distance.
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来源期刊
Journal of Porous Media
Journal of Porous Media 工程技术-工程:机械
CiteScore
3.50
自引率
8.70%
发文量
89
审稿时长
12.5 months
期刊介绍: The Journal of Porous Media publishes original full-length research articles (and technical notes) in a wide variety of areas related to porous media studies, such as mathematical modeling, numerical and experimental techniques, industrial and environmental heat and mass transfer, conduction, convection, radiation, particle transport and capillary effects, reactive flows, deformable porous media, biomedical applications, and mechanics of the porous substrate. Emphasis will be given to manuscripts that present novel findings pertinent to these areas. The journal will also consider publication of state-of-the-art reviews. Manuscripts applying known methods to previously solved problems or providing results in the absence of scientific motivation or application will not be accepted. Submitted articles should contribute to the understanding of specific scientific problems or to solution techniques that are useful in applications. Papers that link theory with computational practice to provide insight into the processes are welcome.
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