用于电子封装的 SiCp/Al 复合材料的最新研究进展

IF 3.6 4区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Reviews on Advanced Materials Science Pub Date : 2024-01-13 DOI:10.1515/rams-2023-0158

Hong Yu, Liu Jiaqin, Wu Yucheng

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引用次数: 0

摘要

随着微电子技术的快速发展，对电子封装材料（EPM）提出了严格的要求。含有高体积分数 SiC 的 SiCp/Al 复合材料在许多领域都具有高热导率、可调热膨胀系数和低密度等优越性能，因此已成为 EPM 的理想候选材料。本研究回顾了近年来 SiCp/Al 复合材料的制造工艺。此外，还总结了 SiCp/Al 复合材料颗粒与基体之间的界面、应用和发展趋势。

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Latest research progress of SiCp/Al composite for electronic packaging

With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.

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来源期刊

Reviews on Advanced Materials Science 工程技术-材料科学：综合

CiteScore

5.10

自引率

11.10%

发文量

审稿时长

3.5 months

期刊介绍： Reviews on Advanced Materials Science is a fully peer-reviewed, open access, electronic journal that publishes significant, original and relevant works in the area of theoretical and experimental studies of advanced materials. The journal provides the readers with free, instant, and permanent access to all content worldwide; and the authors with extensive promotion of published articles, long-time preservation, language-correction services, no space constraints and immediate publication. Reviews on Advanced Materials Science is listed inter alia by Clarivate Analytics (formerly Thomson Reuters) - Current Contents/Physical, Chemical, and Earth Sciences (CC/PC&ES), JCR and SCIE. Our standard policy requires each paper to be reviewed by at least two Referees and the peer-review process is single-blind.