利用轻量级卷积神经网络优化智能制造中基于数字信号处理器的缺陷检测

IF 2.5 Q2 ENGINEERING, INDUSTRIAL
Han Yue, Rucen Wang, Yi Gao, Ailing Xia, Kaikai Su, Jianhua Zhang
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引用次数: 0

摘要

工业缺陷检测是智能制造的重要组成部分,而基于物联网(IoT)的缺陷检测正受到越来越多的关注。虽然深度学习(DL)可以帮助缺陷检测降低成本,提高传统人工质量检测的准确性,但DL需要庞大的计算资源,难以在计算能力和内存资源有限的物联网设备上简单部署。数字信号处理器(DSP)是一种重要的物联网设备,具有体积小、性能高、能耗低等特点,已广泛应用于智能制造领域。为了在 DSP 上进行精确的缺陷检测,作者提出了各种优化策略,然后使用并行方案将模型扩展到多核上执行。作者的方法在东北大学表面缺陷数据集、磁瓦缺陷数据集、铁轨表面缺陷数据集和蚕丝缸缺陷数据集上进行了评估,实验结果表明,与在主流台式机 CPU 上运行相同的卷积神经网络模型相比,作者的方法获得了更快的速度,且没有精度损失。这意味着作者的方法可以在计算能力和内存资源有限的物联网设备上实现高效、准确的缺陷检测,为未来智能制造领域的发展提供了新的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Optimising digital signal processor-based defect detection in smart manufacturing with lightweight convolutional neural networks

Optimising digital signal processor-based defect detection in smart manufacturing with lightweight convolutional neural networks

Industrial defect detection is an important part of intelligent manufacturing, and Internet of things (IoT)-based defect detection is receiving more and more attention. Although deep learning (DL) can help defect detection reduce the cost and improve the accuracy of traditional manual quality inspection, DL requires huge computational resources and is difficult to be simply deployed on IoT devices with limited computational power and memory resources. Digital signal processor (DSP) is an important IoT device with small size, high performance and low energy consumption, which has been widely used in intelligent manufacturing. In order to perform accurate defect detection on DSP, the authors proposed various optimisation strategies and then used a parallel scheme to scale the model to execute on multiple cores. The authors’ method evaluated it on Northeastern University Surface Defect Dataset, Magnetic Tile Defect Dataset, Rail Surface Defect Dataset and Silk Cylinder Defect Dataset, and the experimental results showed that the authors’ method obtains faster speeds without accuracy loss compared to running the same Convolutional Neural Networks model on a mainstream desktop CPU. This means that the authors’ method can realise efficient and accurate defect detection on IoT devices with limited computational power and memory resources, which opens up new possibilities for future development in the field of smart manufacturing.

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来源期刊
IET Collaborative Intelligent Manufacturing
IET Collaborative Intelligent Manufacturing Engineering-Industrial and Manufacturing Engineering
CiteScore
9.10
自引率
2.40%
发文量
25
审稿时长
20 weeks
期刊介绍: IET Collaborative Intelligent Manufacturing is a Gold Open Access journal that focuses on the development of efficient and adaptive production and distribution systems. It aims to meet the ever-changing market demands by publishing original research on methodologies and techniques for the application of intelligence, data science, and emerging information and communication technologies in various aspects of manufacturing, such as design, modeling, simulation, planning, and optimization of products, processes, production, and assembly. The journal is indexed in COMPENDEX (Elsevier), Directory of Open Access Journals (DOAJ), Emerging Sources Citation Index (Clarivate Analytics), INSPEC (IET), SCOPUS (Elsevier) and Web of Science (Clarivate Analytics).
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