二氧化硫对电子元件镀银的腐蚀风险

Mengmeng Zhuang, Jiayu Wang, Jiawei Zhao, Kaixu Ren, Xin Wang, Peng Liu
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引用次数: 0

摘要

随着电子设备的微型化和高度集成化,镀银层的微小腐蚀将严重降低设备的可靠性。二氧化硫作为常见的腐蚀污染物,对银具有很强的腐蚀敏感性。以 ANSI/ISA 71.04 中的 G1 限值为基准,210 个城市的逐小时 SO2 浓度数据显示,SO2 的范围在 1-993μg/m3 之间,平均有 20.80% 的天数比和 8.04% 的小时数比超过 G1 级别要求,表明实际运行环境中存在瞬间高腐蚀风险。对于镀银而言,独立参数的腐蚀风险符合幂函数规律。在多种因素的综合影响下,部分参数的腐蚀阈值会降低,服役电子设备的腐蚀风险会增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Corrosion risk of SO2 on silver plating of electric components
With the miniaturization and high integration of electronic devices, the reliability of the devices will be seriously reduced by the small corrosion of silver plating. As common corrosion pollutants, SO2 have strong corrosion sensitivity to silver. Using the G1 limit in ANSI/ISA 71.04 as the baseline,hour-by-hour SO2 concentration data for 210 cities show that the SO2 ranges from 1-993μg/m3, with an average of 20.80% of days ratio and 8.04% of hours ratio exceeding G1 level requirements, indicate a momentary high corrosion risk in the actual running environment. For silver plating, the corrosion risk of independent parameters conforms to the law of power function. Under the comprehensive influence of multiple factors, the corrosion thresholds of some parameters will decrease and the corrosion risk of electronic devices in service will increase.
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