氮气流速对反应直流磁控溅射法沉积的氮化钒薄膜性能的影响

J. Prathumsit, W. Phae-Ngam, T. Chaikeeree, N. Mungkung, T. Lertvanithphol, M. Horprathum, Ganatee Gitgeatpong
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引用次数: 0

摘要

通过反应式直流磁控溅射法在硅晶片基片上沉积了氮化钒(VN)薄膜,氮气(N2)流速从 5.0 到 8.0 sccm 不等,基片不加热。制备的 VN 薄膜的结晶度、形貌和光学特性分别通过强迫入射 X 射线衍射 (GIXRD)、场发射扫描电子显微镜 (FE-SEM) 和紫外-可见-近红外分光光度计进行了研究。GIXRD 图样显示,薄膜的晶体结构符合面心立方 VN 结构。N2 的增加会导致薄膜厚度和薄层电阻的下降。相反,反射率百分比随着 N2 流量的增加而增加。[版权信息将在生产过程中更新]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
INFLUENCE OF N2 FLOW RATE ON THE PROPERTIES OF VANADIUM NITRIDE THIN FILMS DEPOSITED BY REACTIVE DC MAGNETRON SPUTTERING
Vanadium nitride (VN) thin films have been deposited on silicon wafer substrates by reactive DC magnetron sputtering with varied nitrogen (N2) flow rates from 5.0 to 8.0 sccm without substrate heating. The crystallinity, morphology, and optical properties of the prepared VN films were investigated by gracing-incidence X-ray diffraction (GIXRD), field emission scanning electron microscope (FE-SEM), and UV-Vis-NIR spectrophotometer, respectively. The GIXRD pattern shows that the crystal structure of the films is consistent with the face-centered cubic VN structure. An increase in N2 led to a decrease in film thickness and sheet resistance. On the contrary, the reflectance percentage tends to increase with the increase of N2 flow rate. [Copyright information to be updated in the production process].
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