温度场中钽电容器回流焊接的数值模拟

Chunmei Wang, Yunxiang Lu, Mengdie Wu Surname
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引用次数: 0

摘要

本文旨在模拟和设计钽电容器焊接过程中容易发生故障的热应力。本文定义了分节函数,设置了热应力的边界条件,并通过高温回流焊接过程的温度图划分网格;根据时间变化分析焊机内的温度变化,进行热应力的仿真分析和热应力的截面分析。通过仿真结果,改进设计结构,将焊接过程对电容器故障的影响降至最低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical Simulation of Tantalum Capacitor Reflow Soldering in Temperature Field
This article aims to simulate and design the thermal stress during the welding process of tantalum capacitors, which is prone to failure. In this paper, the subsection function is defined, the boundary conditions of thermal stress are set, and the mesh is divided through the temperature diagram of high temperature reflow welding process; Analyze the temperature changes in the welding machine based on time changes, and conduct simulation analysis of thermal stress and cross-sectional analysis of thermal stress. Through simulation results, improve the design structure to minimize the impact of welding process on capacitor failure.
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