Haoji Wang, J. Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding, Tianyi Sui
{"title":"研磨加工半导体陶瓷波导中的表下损伤诱发的微波频率偏移","authors":"Haoji Wang, J. Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding, Tianyi Sui","doi":"10.3390/machines11121057","DOIUrl":null,"url":null,"abstract":"Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed.","PeriodicalId":48519,"journal":{"name":"Machines","volume":"116 1","pages":""},"PeriodicalIF":2.1000,"publicationDate":"2023-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide\",\"authors\":\"Haoji Wang, J. Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding, Tianyi Sui\",\"doi\":\"10.3390/machines11121057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed.\",\"PeriodicalId\":48519,\"journal\":{\"name\":\"Machines\",\"volume\":\"116 1\",\"pages\":\"\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2023-11-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Machines\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.3390/machines11121057\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Machines","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/machines11121057","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide
Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed.
期刊介绍:
Machines (ISSN 2075-1702) is an international, peer-reviewed journal on machinery and engineering. It publishes research articles, reviews, short communications and letters. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers. Full experimental and/or methodical details must be provided. There are, in addition, unique features of this journal: *manuscripts regarding research proposals and research ideas will be particularly welcomed *electronic files or software regarding the full details of the calculation and experimental procedure - if unable to be published in a normal way - can be deposited as supplementary material Subject Areas: applications of automation, systems and control engineering, electronic engineering, mechanical engineering, computer engineering, mechatronics, robotics, industrial design, human-machine-interfaces, mechanical systems, machines and related components, machine vision, history of technology and industrial revolution, turbo machinery, machine diagnostics and prognostics (condition monitoring), machine design.