Analysis of the thermal effect of two external parallel printed circuit board conductors set on a metal base and operating in a space vacuum on each other

Background. The need to analyze the thermal effect of two external parallel conductors is due to an increase in the density of the conductive pattern. For printed circuit boards set on a metal base and operating in the vacuum of space, this need is aggravated by the weakness of the issue’s development. Aim. Analysis of the mutual influence of two external parallel printed circuit board conductors set on a metal base and operating in a space vacuum on each other to identify the dependence of their temperature on the distance between them and determine the distance at which this dependence practically disappears. Methods. To achieve the purpose, a finite element method calculation implemented in the ANSYS program, the Steady-State Thermal module, was used. Three multilayer printed circuit boards were calculated: 4-layer, 6-layer, 8-layer. The temperature coefficient of resistance was taken into account separately, by recalculation. Results. Graphs of the dependence of overheating (the difference between the temperature of the printed conductor and the metal base) on the distance between the printed conductors were constructed. The approximation of the obtained results is carried out. According to the approximated dependencies, the minimum values of the distances between printed conductors are found, at which the cross influence of printed conductors practically disappears. As the thickness of the printed circuit board increases, this distance increases. Conclusion. The results obtained can help to assess the influence of neighboring printed conductors in the design of the boards of the onboard equipment of spacecraft.