1064 纳米纳秒激光辐照下 HfO2/SiO2 减反射涂层的动态损伤过程研究

chengjiang xiang, Xiaofeng Liu, Chunxian Tao, Dawei Li, Yuanan Zhao, Jian Sun, Weili Zhang, Yuchuan Shao, Jianda Shao
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引用次数: 0

摘要

时间分辨泵浦探针技术是研究光学动态损伤过程的有效方法。本文基于增强电荷耦合器件(ICCD)的时间分辨泵浦探针技术,研究了位于激光入射面(正向过程)和出射面(反向过程)的 HfO2/SiO2 减反射涂层在 1064nm 纳秒激光辐照下的动态损伤过程。在相同通量(52J/cm2)的辐照下,正向和反向过程中都存在未发生层剥离和发生层剥离的凹坑。但是,反向工艺产生的小凹坑的横向尺寸和深度要大于正向工艺。有限元分析表明,正向和反向工艺中基底-涂层界面上的电场强度(EFI)相似,不足以形成损伤形态的差异。这些结果表明,等离子体在随后的激光脉冲照射下形成后的发展过程决定了上述两种情况下的损伤差异。抗反射涂层损伤的时间分辨研究对其损伤机理分析和实际应用具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation on the dynamic damage process of HfO2/SiO2 anti-reflection coatings under 1064nm nanosecond laser irradiation
Time-resolved pump-probe technology is an effective method to study the dynamic damage process of optics. In this paper, the dynamic damage process of HfO2/SiO2 anti-reflection coating, for the cases that the coating located on the laser incidence (forward process) and exit (reverse process) surface, irradiated by a 1064nm nanosecond laser was studied based on the time-resolved pump-probe technology of intensified charge-coupled device (ICCD). Under the irradiation of the same fluence (52J/cm2), pits without and with the layer peeling existed in both forward and reverse processes. However, the lateral size and depth of the small pits generated by the reverse process are larger than those of the forward process. The finite element analysis shows that the electric field intensity (EFI) on the substrate-coating interface for the forward and reverse processes is similar, which is not enough to form the difference in damage morphology. These results indicate the develop process of the plasma after its formation under the subsequent laser pulse irradiation determines the damage difference in the above two cases. The time-resolved study of anti-reflective coating damage is of great significance for its damage mechanism analysis and practical application.
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