电源模块混合封装方法综述

Q1 Engineering

Chinese Journal of Electrical Engineering Pub Date : 2023-12-06 DOI:10.23919/CJEE.2023.000040

Puqi Ning;Xiaoshuang Hui;Yuhui Kang;Tao Fan;Kai Wang;Yunhui Mei;Guangyin Lei

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引用次数: 0

摘要

对功率模块封装的混合结构进行了总结和分类。分析了基本平面线键设计和扩展平面线键设计，并分别与普通线键模块和平面模块进行了比较。自动布局方法可以改善混合结构的电气和热性能。介绍了一种最先进的混合结构，并为未来的设计提供了缓解电流和温度不平衡的建议。

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Review of Hybrid Packaging Methods for Power Modules

The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.

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