Xue Zhou, Yong Zhang, Dao-Yi Wu, Li-Ping Li, Xu Wang, Chen-Song Ji, Guo-Fu Zhai, Rui Kang
{"title":"由表面质量决定电气触点之间的界面粘附力","authors":"Xue Zhou, Yong Zhang, Dao-Yi Wu, Li-Ping Li, Xu Wang, Chen-Song Ji, Guo-Fu Zhai, Rui Kang","doi":"10.1080/00218464.2023.2300759","DOIUrl":null,"url":null,"abstract":"Micro-Electromechanical-Relay (MER) has widely achieved application in the field of engineering thanks to the excellent features and ever-growing interest in microelectronic products. However, the ...","PeriodicalId":501232,"journal":{"name":"The Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interfacial adhesion between electrical contacts determined by surface quality\",\"authors\":\"Xue Zhou, Yong Zhang, Dao-Yi Wu, Li-Ping Li, Xu Wang, Chen-Song Ji, Guo-Fu Zhai, Rui Kang\",\"doi\":\"10.1080/00218464.2023.2300759\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micro-Electromechanical-Relay (MER) has widely achieved application in the field of engineering thanks to the excellent features and ever-growing interest in microelectronic products. However, the ...\",\"PeriodicalId\":501232,\"journal\":{\"name\":\"The Journal of Adhesion\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-01-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Journal of Adhesion\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/00218464.2023.2300759\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Adhesion","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00218464.2023.2300759","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interfacial adhesion between electrical contacts determined by surface quality
Micro-Electromechanical-Relay (MER) has widely achieved application in the field of engineering thanks to the excellent features and ever-growing interest in microelectronic products. However, the ...
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