用于电子设备冷却的中间加热超薄扁平热管热性能实验研究

IF 1.7 4区工程技术 Q3 THERMODYNAMICS

Heat Transfer Research Pub Date : 2023-12-01 DOI:10.1615/heattransres.2023051581

Tengqing Liu, Xuehao He, Yaokang Zhang, Shuangfeng Wang

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引用次数: 0

摘要

为了在有限的空间内冷却电子设备，本研究提出了具有两种工作模式的UTFHP，即单端加热和单端冷却（SHSC）的短UTFHP和中间加热和双端冷却（MHDC）的长UTFHP。为进行性能比较，研究了输入水头载荷和冷却温度对采用 SHSC 的短型UTFHP 和采用 MHDC 的长型UTFHP 热性能的影响。输入水头载荷范围为 0-38 W，冷却温度范围为 15 ℃ 至 65 ℃。结果表明，两层包裹的 200 in-1 筛网可以提供足够的毛细管压力，因此两种 UTFHP 工作模式都表现出良好的温度均匀性。与带有 MHDC 的长UTFHP 相比，带有 SHSC 的短UTFHP 具有更好的热性能。此外，在工作条件范围内，两种UTHP的热阻都随着输入热负荷的增加和冷却温度的降低而降低。

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Experimental investigation on thermal performance of ultra-thin flattened heat pipe with middle heating for electronics cooling

For cooling the electronics in limited space, this study proposes UTFHP with two working modes, i.e., short UTFHP with single-end heating and single-end cooling (SHSC) and long UTFHP with middle heating and dual-end cooling (MHDC). The effects of input head load and cooling temperature on the thermal performance of the short UTFHP with SHSC and long UTFHP with MHDC have been studied for the performance comparison. The input head load ranges from 0-38 W and the cooling temperature ranges from 15 ℃ to 65 ℃. The results show that the two layers wrapped 200 in-1 screen mesh can provide adequate capillary pressure, hence, both of the two UTFHP working modes show good temperature uniformity. The short UTFHP with SHSC shows better thermal performance compared to the performance of long UTFHP with MHDC. In addition, the thermal resistances of both UTFHPs decrease with the increase of the input heat load and the decrease of the cooling temperature under the ranges of operating conditions.

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来源期刊

Heat Transfer Research 工程技术-热力学

CiteScore

3.10

自引率

23.50%

发文量

102

审稿时长

13.2 months

期刊介绍： Heat Transfer Research (ISSN1064-2285) presents archived theoretical, applied, and experimental papers selected globally. Selected papers from technical conference proceedings and academic laboratory reports are also published. Papers are selected and reviewed by a group of expert associate editors, guided by a distinguished advisory board, and represent the best of current work in the field. Heat Transfer Research is published under an exclusive license to Begell House, Inc., in full compliance with the International Copyright Convention. Subjects covered in Heat Transfer Research encompass the entire field of heat transfer and relevant areas of fluid dynamics, including conduction, convection and radiation, phase change phenomena including boiling and solidification, heat exchanger design and testing, heat transfer in nuclear reactors, mass transfer, geothermal heat recovery, multi-scale heat transfer, heat and mass transfer in alternative energy systems, and thermophysical properties of materials.