板材对流-薄膜冷却过程中狭缝通道附近保护膜的形成模型

Q3 Mathematics
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引用次数: 0

摘要

摘要 基于粘性可压缩导热气体雷诺平均运动方程组的求解,计算了在平板形成对流膜保护过程中气体的热场和速度场。气体动力学的求解采用了显式麦科马克方法,并沿空间方向分割了初始算子和非线性修正方案。Spalart-Allmaras 湍流模型与近壁速度函数一起使用。块有限差分网格由汤普森方法构建。在从平缝隙喷射的射流的不同倾角下,确定了板两侧的气体动态函数场。板的温度场和薄膜冷却效率参数以准静态近似方式定义。利用速度和热近壁函数获得了板表面温度的估计值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Model of Protective Film Formation in the Vicinity of a Slit Channel During the Convective-Film Cooling of a Plate

Abstract

Based on the solution of the Reynolds-averaged system of equations of motion of a viscous compressible heat-conducting gas, the thermal and velocity fields of the gas during the formation of convective-film protection of a flat plate are calculated. The gas dynamics are solved using the explicit McCormack method with the splitting of the initial operator along spatial directions and a nonlinear correction scheme. The Spalart−Allmaras turbulence model is used together with the near-wall velocity function. The block finite-difference mesh is constructed by the Thompson method. The fields of the gas dynamic functions on both sides of the plate are determined at different inclination angles of a jet injected from a flat slit. The temperature field of the plate and the film cooling efficiency parameter are defined in a quasi-static approximation. Estimates of the temperature of the plate surfaces are obtained using the velocity and thermal near-wall functions.

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来源期刊
Mathematical Models and Computer Simulations
Mathematical Models and Computer Simulations Mathematics-Computational Mathematics
CiteScore
1.20
自引率
0.00%
发文量
99
期刊介绍: Mathematical Models and Computer Simulations  is a journal that publishes high-quality and original articles at the forefront of development of mathematical models, numerical methods, computer-assisted studies in science and engineering with the potential for impact across the sciences, and construction of massively parallel codes for supercomputers. The problem-oriented papers are devoted to various problems including industrial mathematics, numerical simulation in multiscale and multiphysics, materials science, chemistry, economics, social, and life sciences.
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