开发液体垫圈工艺

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摘要

为密封电子产品,制造商传统上使用预成型、模制或预冲孔垫片,或安装弹性条状轮廓或自粘泡沫,所有这些都有明显的缺点。液体垫片方法克服了这些缺点,降低了模具和库存成本,易于适应部件设计变更和零件变化,提供了更大的设计灵活性。在本文中,总部位于英国的 Intertronics 公司(该公司提供密封剂、涂料、粘合剂和点胶设备)技术销售主管 Matthew Baseley 讨论了开发液体垫圈工艺时的注意事项。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Developing a liquid gasket process
To seal electronic products, manufacturers have traditionally used preformed, moulded or pre-punched gaskets, or the installation of elastomeric strip profiles or self-adhesive foams – all of which have clear downsides. Liquid gasketing approaches overcome these drawbacks by offering reduced tooling and inventory costs, easily accommodating component design changes and part variation to provide more design flexibility. In this article, Matthew Baseley, Technical Sales Executive, UK-based Intertronics – which supplies sealants, coatings, adhesives and dispensing equipment – discusses the considerations when developing a liquid gasket process.
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