用透射电子显微镜研究钽/钽镍纳米层系统的结构

Q4 Physics and Astronomy

Defect and Diffusion Forum Pub Date : 2023-12-12 DOI:10.4028/p-rX2K0B

B. Sobel, K. Lukaszkowicz, M. Pawlyta

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引用次数: 0

摘要

现代材料工程最重要的挑战之一是提高材料的效率和耐用性，这直接意味着减少原材料的消耗。在许多应用中，这些目标都是通过强化和功能化表面（尤其是纳米涂层）来实现的。本研究的材料是通过 ALD 技术（原子层沉积，Picosun 公司的 R200）获得的 Ta/TaN 多层系统。在对其结构进行表征时，使用了电子显微镜（HR STEM、电子衍射、EDS、EELS）。确定了几何参数（Ta 和 TaN 组成层的厚度、金属层和陶瓷层的厚度比），并验证了它们的化学成分和相组成。获得的结果将用于建立机械性能模型和解释纳米压痕实验测量结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Structure of Ta/TaN Nanolayered Systems Investigated by Transmission Electron Microscopy

One of the most important challenges of modern materials engineering is to improve the efficiency and durability of materials, which directly translates into reducing the consumption of raw materials. In many applications, these goals are achieved by strengthening and functionalizing the surface, especially in the case of nanocoatings. The material for the study is the Ta/TaN multilayer systems obtained with the ALD technique (Atomic Layer Deposition, R200 by Picosun). For their structure characterisation electron microscopy (HR STEM, electron diffraction, EDS, EELS) was used. Geometrical parameters (thickness of the constituent Ta and TaN layers, ratio of thicknesses of metallic and ceramic layers) were determined, and their chemical and phase compositions were verified. The obtained results will be used to model mechanical properties and interpret the results of experimental nanoindentation measurements.

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来源期刊

Defect and Diffusion Forum Physics and Astronomy-Radiation

CiteScore

1.20

自引率

0.00%

发文量

127

期刊介绍： Defect and Diffusion Forum (formerly Part A of ''''Diffusion and Defect Data'''') is designed for publication of up-to-date scientific research and applied aspects in the area of formation and dissemination of defects in solid materials, including the phenomena of diffusion. In addition to the traditional topic of mass diffusion, the journal is open to papers from the area of heat transfer in solids, liquids and gases, materials and substances. All papers are peer-reviewed and edited. Members of Editorial Boards and Associate Editors are invited to submit papers for publication in “Defect and Diffusion Forum” . Authors retain the right to publish an extended and significantly updated version in another periodical.