利用无电解电镀法制备二氧化硅/银微珠及其性能

IF 0.6 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materiali in tehnologije Pub Date : 2023-12-11 DOI:10.17222/mit.2023.778

Congcong Zhang, Xiaolei Su, Jiaqi Yan, Yi Liu

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引用次数: 0

摘要

通过改变添加顺序和化学电镀混合法，采用化学电镀法合成了 SiO2/Ag 微珠。分别以制备的 SiO2/Ag 微珠和不饱和聚酯树脂为填料和基材制备了导电复合材料。使用扫描电子显微镜（SEM）、X 射线衍射仪（XRD）、能量色散光谱仪（EDS）、粒度分析仪、直流毫欧计和矢量网络分析测试仪对制备的微珠和复合材料的微观结构和性能进行了表征。结果表明，采用反滴落无电解电镀法制备的 SiO2/Ag 微珠在玻璃珠表面的银镀层的均匀性和完整性最好，其抗压强度达到 138.80 mΩ-cm。当制备的二氧化硅/银微珠与不饱和聚酯树脂的比例为 1:2 时，得到的涂层复合材料的电阻率为 2.79 × 10-5 Ω-cm，显示出良好的电磁屏蔽性能。

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PREPARATION AND PROPERTIES OF SiO2/Ag MICROBEADS USING ELECTROLESS PLATING METHOD

SiO2/Ag microbeads were synthesized using the electroless plating method by changing the addition order and the mixed method of electroless plating. Conducting composites were prepared using the prepared SiO2/Ag microbeads and unsaturated polyester resin as the fillers and substrate, respectively. The microstructure and properties of the prepared microbeads and composite were characterized with a scanning electron microscope (SEM), X-ray diffractometer (XRD), energy dispersive spectrometer (EDS), particle size analyzer, DC milliohm meter and vector network analysis tester. Results show that the SiO2/Ag microbeads prepared with the reverse dropping electroless plating method achieved the best uniformity and integrity of the silver coating on the surfaces of glass beads, and its compaction resistance reached 138.80 mΩ·cm. When the ratio of the prepared SiO2/Ag microbeads and unsaturated polyester resin was 1:2, the obtained coating composite had a resistivity of 2.79 × 10–5 Ω·cm, showing good electromagnetic shielding performance.

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来源期刊

Materiali in tehnologije 工程技术-材料科学：综合

CiteScore

1.30

自引率

0.00%

发文量

审稿时长

4-8 weeks

期刊介绍： The journal MATERIALI IN TEHNOLOGIJE/MATERIALS AND TECHNOLOGY is a scientific journal, devoted to original papers and review scientific papers concerned with the areas of fundamental and applied science and technology. Topics of particular interest include metallic materials, inorganic materials, polymers, vacuum technique and lately nanomaterials.