Sudhanshu Kumar, Ashutosh Rajput, Surajit Kumar Paul, M. Tiwari, D. K. Prajapati
{"title":"干滑动条件下金属接触的摩擦和磨损研究:基于分子动力学模拟的方法","authors":"Sudhanshu Kumar, Ashutosh Rajput, Surajit Kumar Paul, M. Tiwari, D. K. Prajapati","doi":"10.1177/13506501231220076","DOIUrl":null,"url":null,"abstract":"Sliding friction originating due to ploughing and adhesive wear significantly affects the performance of small-scale components, that is, nano-electromechanical systems/micro-electromechanical. To get a comprehensive understanding of the friction mechanisms, a comprehensive study of surface interactions at the nanoscale is crucial, particularly when dealing with nano-electromechanical and micro-electromechanical components. This study performed molecular dynamics simulation to explore the interactions between asperities (made of similar/dissimilar materials) at the nanoscale under dry sliding conditions. The research framework focuses on modelling the contact between two hemispherical asperities during dry sliding by considering three material combinations: soft-to-soft (Cu–Cu), hard-to-hard (Fe–Fe), and hard-to-soft (Fe–Cu). The study assesses plastic deformation and atomic wear at specific sliding speeds. Notably, the results indicate that the frictional force on the lower asperity increases as interference increases. Additionally, atomic wear rises with increased interference in the case of the Fe–Cu tribopair. Particularly high atomic wear is observed in the Cu–Cu tribopair due to the ease of slip within the face-centred cubic crystal structure of copper.","PeriodicalId":20570,"journal":{"name":"Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2023-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Friction and wear study of metallic contacts under dry sliding conditions: A molecular dynamics simulation-based approach\",\"authors\":\"Sudhanshu Kumar, Ashutosh Rajput, Surajit Kumar Paul, M. Tiwari, D. K. Prajapati\",\"doi\":\"10.1177/13506501231220076\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Sliding friction originating due to ploughing and adhesive wear significantly affects the performance of small-scale components, that is, nano-electromechanical systems/micro-electromechanical. To get a comprehensive understanding of the friction mechanisms, a comprehensive study of surface interactions at the nanoscale is crucial, particularly when dealing with nano-electromechanical and micro-electromechanical components. This study performed molecular dynamics simulation to explore the interactions between asperities (made of similar/dissimilar materials) at the nanoscale under dry sliding conditions. The research framework focuses on modelling the contact between two hemispherical asperities during dry sliding by considering three material combinations: soft-to-soft (Cu–Cu), hard-to-hard (Fe–Fe), and hard-to-soft (Fe–Cu). The study assesses plastic deformation and atomic wear at specific sliding speeds. Notably, the results indicate that the frictional force on the lower asperity increases as interference increases. Additionally, atomic wear rises with increased interference in the case of the Fe–Cu tribopair. Particularly high atomic wear is observed in the Cu–Cu tribopair due to the ease of slip within the face-centred cubic crystal structure of copper.\",\"PeriodicalId\":20570,\"journal\":{\"name\":\"Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2023-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1177/13506501231220076\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1177/13506501231220076","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Friction and wear study of metallic contacts under dry sliding conditions: A molecular dynamics simulation-based approach
Sliding friction originating due to ploughing and adhesive wear significantly affects the performance of small-scale components, that is, nano-electromechanical systems/micro-electromechanical. To get a comprehensive understanding of the friction mechanisms, a comprehensive study of surface interactions at the nanoscale is crucial, particularly when dealing with nano-electromechanical and micro-electromechanical components. This study performed molecular dynamics simulation to explore the interactions between asperities (made of similar/dissimilar materials) at the nanoscale under dry sliding conditions. The research framework focuses on modelling the contact between two hemispherical asperities during dry sliding by considering three material combinations: soft-to-soft (Cu–Cu), hard-to-hard (Fe–Fe), and hard-to-soft (Fe–Cu). The study assesses plastic deformation and atomic wear at specific sliding speeds. Notably, the results indicate that the frictional force on the lower asperity increases as interference increases. Additionally, atomic wear rises with increased interference in the case of the Fe–Cu tribopair. Particularly high atomic wear is observed in the Cu–Cu tribopair due to the ease of slip within the face-centred cubic crystal structure of copper.
期刊介绍:
The Journal of Engineering Tribology publishes high-quality, peer-reviewed papers from academia and industry worldwide on the engineering science associated with tribology and its applications.
"I am proud to say that I have been part of the tribology research community for almost 20 years. That community has always seemed to me to be highly active, progressive, and closely knit. The conferences are well attended and are characterised by a warmth and friendliness that transcends national boundaries. I see Part J as being an important part of that community, giving us an outlet to publish and promote our scholarly activities. I very much look forward to my term of office as editor of your Journal. I hope you will continue to submit papers, help out with reviewing, and most importantly to read and talk about the work you will find there." Professor Rob Dwyer-Joyce, Sheffield University, UK
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