传导冷却端泵浦板条激光放大器焊接表面热应力模拟

Lu Chen, S. Bian, Lei Liu, Wentao Wang
{"title":"传导冷却端泵浦板条激光放大器焊接表面热应力模拟","authors":"Lu Chen, S. Bian, Lei Liu, Wentao Wang","doi":"10.1117/12.3011141","DOIUrl":null,"url":null,"abstract":"This paper introduces the thermal effect of the slab amplifying module in the high-energy solid-state laser, mainly simulates the influence of the thickness of the metal indium layer on the welding surface of the slab and the heat sink on the thermal effect of the slab, and analyzes the effect of different thicknesses of the indium layer on the thermal effect of the slab. The thickness of the metal indium layer used in the calculation is 10μm, 40μm and 80μm respectively. This paper provides a powerful reference for the engineering application of high-power and high-beam-quality all-solid-state laser systems.","PeriodicalId":298662,"journal":{"name":"Applied Optics and Photonics China","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier\",\"authors\":\"Lu Chen, S. Bian, Lei Liu, Wentao Wang\",\"doi\":\"10.1117/12.3011141\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces the thermal effect of the slab amplifying module in the high-energy solid-state laser, mainly simulates the influence of the thickness of the metal indium layer on the welding surface of the slab and the heat sink on the thermal effect of the slab, and analyzes the effect of different thicknesses of the indium layer on the thermal effect of the slab. The thickness of the metal indium layer used in the calculation is 10μm, 40μm and 80μm respectively. This paper provides a powerful reference for the engineering application of high-power and high-beam-quality all-solid-state laser systems.\",\"PeriodicalId\":298662,\"journal\":{\"name\":\"Applied Optics and Photonics China\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-12-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Optics and Photonics China\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.3011141\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Optics and Photonics China","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.3011141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了高能固体激光器中板坯放大模块的热效应,主要模拟了板坯焊接面和散热器上金属铟层厚度对板坯热效应的影响,分析了不同厚度的铟层对板坯热效应的影响。计算中使用的金属铟层厚度分别为 10μm、40μm 和 80μm。本文为高功率、高光束质量全固态激光系统的工程应用提供了有力的参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier
This paper introduces the thermal effect of the slab amplifying module in the high-energy solid-state laser, mainly simulates the influence of the thickness of the metal indium layer on the welding surface of the slab and the heat sink on the thermal effect of the slab, and analyzes the effect of different thicknesses of the indium layer on the thermal effect of the slab. The thickness of the metal indium layer used in the calculation is 10μm, 40μm and 80μm respectively. This paper provides a powerful reference for the engineering application of high-power and high-beam-quality all-solid-state laser systems.
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