{"title":"含填料环氧胶粘剂复合材料抗压强度对比分析","authors":"Jacek Ogrodniczek, Anna Rudawska, Miroslav Müller","doi":"10.1080/00218464.2023.2286295","DOIUrl":null,"url":null,"abstract":"The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in v...","PeriodicalId":501232,"journal":{"name":"The Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparative analysis of compressive strength of epoxy adhesive compounds containing fillers\",\"authors\":\"Jacek Ogrodniczek, Anna Rudawska, Miroslav Müller\",\"doi\":\"10.1080/00218464.2023.2286295\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in v...\",\"PeriodicalId\":501232,\"journal\":{\"name\":\"The Journal of Adhesion\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Journal of Adhesion\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/00218464.2023.2286295\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Adhesion","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00218464.2023.2286295","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparative analysis of compressive strength of epoxy adhesive compounds containing fillers
The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in v...
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