横向驱动多晶硅谐振微结构

William C. Tang, Tu-Cuong H. Nguyen, Roger T. Howe
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引用次数: 0

摘要

交叉指状(梳状)结构可以有效地激发平行于衬底平面的多晶硅微结构的静电共振。采用2 μm厚的掺磷低压化学气相沉积(LPCVD)多晶硅薄膜制备了以折叠悬臂桁架悬挂的线性板和以螺旋弹簧和蛇形弹簧悬挂的扭转板。从视觉上观察到共振,频率范围从18千赫到80千赫,质量因子从20到130。简单的梁理论足以计算共振频率,使用140gpa的杨氏模量,忽略释放结构中的残余应变。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Laterally Driven Polysilicon Resonant Microstructures

Interdigitated finger (comb) structures are demonstrated to be effective for exciting electrostatically the resonance of polysilicon microstructures parallel to the plane of the substrate. Linear plates suspended by a folded-cantilever truss and torsional plates suspended by spiral and serpentine springs are fabricated from a 2 μm-thick phosphorus-doped low-pressure chemical-vapor-deposited (LPCVD) polysilicon film. Resonance is observed visually, with frequencies ranging from 18 kHz to 80 kHz and quality factors from 20 to 130. Simple beam theory is adequate for calculating the resonance frequencies, using a Young's modulus of 140 GPa and neglecting residual strain in the released structures.

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