FASTPIX亚纳秒CMOS像素传感器演示器的测试光束性能结果

Justus Braach, Eric Buschmann, Dominik Dannheim, Katharina Dort, Thanushan Kugathasan, Magdalena Munker, Walter Snoeys, Peter Švihra, Mateus Vicente
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引用次数: 1

摘要

在吸引FASTPIX项目中,采用改进的180纳米CMOS成像工艺技术开发了单片像素传感器演示芯片,目标是单个电离粒子的亚纳秒定时精度。它在25 μm厚的外延层上设计了一个小型收集电极,包含32个微型矩阵,每个矩阵有68个六边形像素,像素间距从8.66到20 μm不等。4个像素发送模拟输出信号,64个像素发送二进制命中信息。探索了各种设计变化,旨在加速电荷收集,并使电荷收集的时间在像素区域内更加均匀。模拟波形的信号处理以及数字位置、时间和电荷信息的重建都是在片外完成的。这篇文章介绍了传感器和读出系统的设计,并介绍了在最近使用外部跟踪和定时参考探测器的测试光束测量中实现的各种像素设计的性能结果。在所有像素间距下获得低于150 ps的时间分辨率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test-beam performance results of the FASTPIX sub-nanosecond CMOS pixel sensor demonstrator
Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 μm-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches ranging from 8.66 to 20 μm. Four pixels are transmitting an analog output signal and 64 are transmitting binary hit information. Various design variations are explored, aiming at accelerating the charge collection and making the timing of the charge collection more uniform over the pixel area. Signal treatment of the analog waveforms, as well as reconstruction of digital position, time and charge information, is carried out off-chip. This contribution introduces the design of the sensor and readout system and presents performance results for various pixel designs achieved in recent test-beam measurements with external tracking and timing reference detectors. A time resolution below 150 ps is obtained at full efficiency for all pixel pitches.
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