一种用于强电场微流体的简单电极绝缘和通道制造技术

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Gaurav Anand, Samira Safaripour, Jaynie Tercovich, Jenna Capozzi, Mark Griffin, Nathan Schin, Nicholas Mirra, Craig Snoeyink
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引用次数: 1

摘要

摘要:介绍了一种简单而坚固的电极绝缘技术,该技术可以承受高达1000 V的电压,这相当于在10 μ m通道上填充电导率为0.1 S m−1(即高于海水电导率)的电解质的电场强度为1 MV m−1。采用多介电层的方法制备阻塞电极,有助于减少材料缺陷的数量。具有特殊击穿电场强度的介质绝缘在电极之间的电解质中具有广泛的应用,如基于高电场强度的介电电泳。研究了不同浓度氯化钠溶液的电压-电流特性,以估计所提出材料的绝缘强度,并计算了电绝缘失效点的击穿强度。还演示了详细的粘附技术,这将减少使用SU-8制造密封通道的模糊性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Simple Electrode Insulation and Channel Fabrication Technique for High-Electric Field Microfluidics
Abstract A simple and robust electrode insulation technique that can withstand a voltage as high as 1000 V , which is equivalent to an electric field strength of 1 MV m −1 across a 10 μ m channel filled with an electrolyte of conductivity 0.1 S m −1 , i.e. higher than sea water’s conductivity, is introduced. A multi-dielectric layers approach is adopted to fabricate the blocked electrodes, which helps reduce the number of material defects. Dielectric insulation with an exceptional breakdown electric field strength for an electrolyte confined between electrodes can have a wide range of applications in microfluidics, like high electric field strength-based dielectrophoresis. The voltage-current characteristics are studied for various concentrations of sodium chloride solution to estimate the insulation strength of the proposed materials, and the breakdown strength is calculated at the point where the electrical insulation failed. A detailed adhesion technique is also demonstrated, which will reduce the ambiguity around the fabrication of a sealed channel using SU-8.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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