粗铜包线的研制

Kenta MATSUOKA, Akihito HOSHIMA, Hiromu IZUMIDA, Mitsuhiro KIMURA
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引用次数: 0

摘要

随着物联网社会的发展,对铜合金等导体材料的需求也在不断增加。导体材料所要求的性能是多种多样的,包括高强度、轻量化、高柔韧性和弹性,因此选择符合所要求性能的铜合金。然而,许多铜合金在强度和导电性之间有一种权衡关系。由于电导率具有较高的优先级,因此所选材料的强度有低于要求水平的趋势。其中,铜铍合金是一种既有强度又有导电性的导电材料,具有优异的弹簧性能,但仍存在可能对人体产生不良影响、成本高等问题。本文报道了为解决这些问题而研制的高强度导体TCC导线的物理性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of Thick Copper Covered Wire
The need for conductor materials such as copper alloys is increasing as the IoT of society progresses. The properties required for conductor materials are diverse, including high strength, light weight, high flexibility, and elasticity, therefore copper alloys that match the required properties are selected. However, many copper alloys have a trade- off relationship between strength and conductivity. Since conductivity has the higher priority, the strength of selected material has the tendency of being short of the required level. Among them, copper beryllium alloy is a conductive material that has both strength and conductivity, and has excellent spring properties, but there are still problems such as the possibility of adverse effects on the human body and the high cost. In this paper, we report the physical properties of TCC wire, a high-strength conductor developed to solve these problems.
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