{"title":"疏水和超疏水界面水滴凝结传热模型","authors":"R. YUVARAJ, D. SENTHILKUMAR","doi":"10.18186/thermal.1374673","DOIUrl":null,"url":null,"abstract":"Heat transfer models for condensation on hydrophobic and superhydrophobic interfaces are broadly available based on thermal resistance correlations. In the previous studies, very few models are presented based on the scaling factor or Nusselt number, and no model is available that directly correlates Biot number. This study develops a heat transfer model for dropwise condensation underneath a horizontal surface. The present model correlates with the Biot number to predict the heat transfer, temperature variation at the interfaces, solid-liquid, and liquid-vapor, and the growth rate of droplet condensate on the hydrophobic and superhydro-phobic interfaces by using Archimedes’ hat-box theorem. The present model is validated with analytical and experimental results against hydrophobic and superhydrophobic contact angles of similar working parameters made excellent agreements. The analytical model for dropwise condensation produces inaccurate results due to discrepancies and discontinuities due to mul-tiple correlations in the modeling. The present model is modified to obtain a continuous result using experimental data. The modified model is used for analyzing heat transfer by varying Biot numbers from 0.0001 to 1000 using Python 3.6.1 with an accuracy of 10-4. Simulation of the present model results in constant heat transfer at Bi = 4, irrespective of the contact angle. A negligible amount of coating resistance and interface resistance when Bi > 0.1, curvature effect when Bi > 0.04, droplet resistance when Bi < 0.02, the maximum liquid-vapor interface tem-perature at Bi ≈ 10, and maximum solid-liquid interface temperature at Bi ≈ 5, are presented.","PeriodicalId":45841,"journal":{"name":"Journal of Thermal Engineering","volume":null,"pages":null},"PeriodicalIF":1.1000,"publicationDate":"2023-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Heat transfer model for dropwise condensation on hydrophobic and superhydrophobic interfaces\",\"authors\":\"R. YUVARAJ, D. SENTHILKUMAR\",\"doi\":\"10.18186/thermal.1374673\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Heat transfer models for condensation on hydrophobic and superhydrophobic interfaces are broadly available based on thermal resistance correlations. In the previous studies, very few models are presented based on the scaling factor or Nusselt number, and no model is available that directly correlates Biot number. This study develops a heat transfer model for dropwise condensation underneath a horizontal surface. The present model correlates with the Biot number to predict the heat transfer, temperature variation at the interfaces, solid-liquid, and liquid-vapor, and the growth rate of droplet condensate on the hydrophobic and superhydro-phobic interfaces by using Archimedes’ hat-box theorem. The present model is validated with analytical and experimental results against hydrophobic and superhydrophobic contact angles of similar working parameters made excellent agreements. The analytical model for dropwise condensation produces inaccurate results due to discrepancies and discontinuities due to mul-tiple correlations in the modeling. The present model is modified to obtain a continuous result using experimental data. The modified model is used for analyzing heat transfer by varying Biot numbers from 0.0001 to 1000 using Python 3.6.1 with an accuracy of 10-4. Simulation of the present model results in constant heat transfer at Bi = 4, irrespective of the contact angle. A negligible amount of coating resistance and interface resistance when Bi > 0.1, curvature effect when Bi > 0.04, droplet resistance when Bi < 0.02, the maximum liquid-vapor interface tem-perature at Bi ≈ 10, and maximum solid-liquid interface temperature at Bi ≈ 5, are presented.\",\"PeriodicalId\":45841,\"journal\":{\"name\":\"Journal of Thermal Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.1000,\"publicationDate\":\"2023-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Thermal Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.18186/thermal.1374673\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Thermal Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.18186/thermal.1374673","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
摘要
基于热阻相关性的疏水和超疏水界面冷凝传热模型广泛可用。在以往的研究中,基于比例因子或Nusselt数的模型很少,也没有与Biot数直接相关的模型。本研究建立了水平面下水滴凝结的传热模型。该模型利用阿基米德帽盒定理与Biot数相关联,预测了疏水和超疏水界面上的传热、界面温度变化、固液界面和汽液界面以及液滴凝结水的生长速率。用分析和实验结果对模型进行了验证,对疏水和超疏水接触角的相似工作参数进行了很好的验证。由于建模过程中多重相关的差异和不连续性,水滴状冷凝的解析模型产生了不准确的结果。利用实验数据对模型进行了修正,得到了连续的结果。利用Python 3.6.1对Biot值在0.0001 ~ 1000范围内变化的传热模型进行了分析,精度为10-4。本模型的模拟结果表明,在Bi = 4时,无论接触角如何,传热都是恒定的。当Bi >0.1, Bi >时的曲率效应;0.04, Bi <时液滴阻力;得到了Bi≈10时的最大液-汽界面温度为0.02,Bi≈5时的最大固-液界面温度为0.02。
Heat transfer model for dropwise condensation on hydrophobic and superhydrophobic interfaces
Heat transfer models for condensation on hydrophobic and superhydrophobic interfaces are broadly available based on thermal resistance correlations. In the previous studies, very few models are presented based on the scaling factor or Nusselt number, and no model is available that directly correlates Biot number. This study develops a heat transfer model for dropwise condensation underneath a horizontal surface. The present model correlates with the Biot number to predict the heat transfer, temperature variation at the interfaces, solid-liquid, and liquid-vapor, and the growth rate of droplet condensate on the hydrophobic and superhydro-phobic interfaces by using Archimedes’ hat-box theorem. The present model is validated with analytical and experimental results against hydrophobic and superhydrophobic contact angles of similar working parameters made excellent agreements. The analytical model for dropwise condensation produces inaccurate results due to discrepancies and discontinuities due to mul-tiple correlations in the modeling. The present model is modified to obtain a continuous result using experimental data. The modified model is used for analyzing heat transfer by varying Biot numbers from 0.0001 to 1000 using Python 3.6.1 with an accuracy of 10-4. Simulation of the present model results in constant heat transfer at Bi = 4, irrespective of the contact angle. A negligible amount of coating resistance and interface resistance when Bi > 0.1, curvature effect when Bi > 0.04, droplet resistance when Bi < 0.02, the maximum liquid-vapor interface tem-perature at Bi ≈ 10, and maximum solid-liquid interface temperature at Bi ≈ 5, are presented.
期刊介绍:
Journal of Thermal Enginering is aimed at giving a recognized platform to students, researchers, research scholars, teachers, authors and other professionals in the field of research in Thermal Engineering subjects, to publish their original and current research work to a wide, international audience. In order to achieve this goal, we will have applied for SCI-Expanded Index in 2021 after having an Impact Factor in 2020. The aim of the journal, published on behalf of Yildiz Technical University in Istanbul-Turkey, is to not only include actual, original and applied studies prepared on the sciences of heat transfer and thermodynamics, and contribute to the literature of engineering sciences on the national and international areas but also help the development of Mechanical Engineering. Engineers and academicians from disciplines of Power Plant Engineering, Energy Engineering, Building Services Engineering, HVAC Engineering, Solar Engineering, Wind Engineering, Nanoengineering, surface engineering, thin film technologies, and Computer Aided Engineering will be expected to benefit from this journal’s outputs.