三轴压阻式力传感器探头采用三维缺口结构,具有高灵敏度和刚度

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hidetoshi Takahashi, Yusuke Takei, Kentaro Noda, Kiyoshi Matsumoto, Isao Shimoyama
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引用次数: 0

摘要

提出了一种高灵敏度、高刚度的微机电系统三轴压阻式力传感器探头。传感器探头由一个悬臂梁和四个支撑梁组成。四根梁中的两根在根部有水平缺口部分,侧壁掺杂的压电阻被用来检测面内变形。在其余两根梁的根部有一个垂直缺口,在其中一根梁上有一个表面掺杂压敏电阻来检测面外变形。因此,由于相应的压阻式缺口结构,所提出的传感器探头测量了施加在悬臂尖端的三个方向力,具有高灵敏度和刚度。我们演示了一种形成缺口结构的制造工艺以及表面和侧壁掺杂的方法。我们的装置被证实能够以亚微牛顿水平的力分辨率测量三轴力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Triaxial piezoresistive force sensor probe with high sensitivity and stiffness using 3D notch structure
Abstract This paper proposes a microelectromechanical system triaxial piezoresistive force sensor probe with high sensitivity and stiffness. The sensor probe is composed of a cantilever and four supporting beams. Two of the four beams had horizontal notch parts at the root, and sidewall-doped piezoresistors were utilised to detect the in-plane deformation. There was a vertical notch at the root of the remaining two beams and a surface-doping piezoresistor in one beam to detect the out-of-plane deformation. Thus, the proposed sensor probe measures the three directional forces applied to the cantilever tip with high sensitivity and stiffness owing to the corresponding piezoresistive notch structures. We demonstrate a fabrication process that forms the notch structure and the surface and sidewall doping methods. Our fabricated device was confirmed capable of measuring triaxial forces with a force resolution at the sub-micro-Newton level.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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