{"title":"三轴压阻式力传感器探头采用三维缺口结构,具有高灵敏度和刚度","authors":"Hidetoshi Takahashi, Yusuke Takei, Kentaro Noda, Kiyoshi Matsumoto, Isao Shimoyama","doi":"10.1088/1361-6439/ad00c6","DOIUrl":null,"url":null,"abstract":"Abstract This paper proposes a microelectromechanical system triaxial piezoresistive force sensor probe with high sensitivity and stiffness. The sensor probe is composed of a cantilever and four supporting beams. Two of the four beams had horizontal notch parts at the root, and sidewall-doped piezoresistors were utilised to detect the in-plane deformation. There was a vertical notch at the root of the remaining two beams and a surface-doping piezoresistor in one beam to detect the out-of-plane deformation. Thus, the proposed sensor probe measures the three directional forces applied to the cantilever tip with high sensitivity and stiffness owing to the corresponding piezoresistive notch structures. We demonstrate a fabrication process that forms the notch structure and the surface and sidewall doping methods. Our fabricated device was confirmed capable of measuring triaxial forces with a force resolution at the sub-micro-Newton level.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"62 2","pages":"0"},"PeriodicalIF":2.4000,"publicationDate":"2023-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Triaxial piezoresistive force sensor probe with high sensitivity and stiffness using 3D notch structure\",\"authors\":\"Hidetoshi Takahashi, Yusuke Takei, Kentaro Noda, Kiyoshi Matsumoto, Isao Shimoyama\",\"doi\":\"10.1088/1361-6439/ad00c6\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract This paper proposes a microelectromechanical system triaxial piezoresistive force sensor probe with high sensitivity and stiffness. The sensor probe is composed of a cantilever and four supporting beams. Two of the four beams had horizontal notch parts at the root, and sidewall-doped piezoresistors were utilised to detect the in-plane deformation. There was a vertical notch at the root of the remaining two beams and a surface-doping piezoresistor in one beam to detect the out-of-plane deformation. Thus, the proposed sensor probe measures the three directional forces applied to the cantilever tip with high sensitivity and stiffness owing to the corresponding piezoresistive notch structures. We demonstrate a fabrication process that forms the notch structure and the surface and sidewall doping methods. Our fabricated device was confirmed capable of measuring triaxial forces with a force resolution at the sub-micro-Newton level.\",\"PeriodicalId\":16346,\"journal\":{\"name\":\"Journal of Micromechanics and Microengineering\",\"volume\":\"62 2\",\"pages\":\"0\"},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2023-11-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micromechanics and Microengineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6439/ad00c6\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad00c6","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Triaxial piezoresistive force sensor probe with high sensitivity and stiffness using 3D notch structure
Abstract This paper proposes a microelectromechanical system triaxial piezoresistive force sensor probe with high sensitivity and stiffness. The sensor probe is composed of a cantilever and four supporting beams. Two of the four beams had horizontal notch parts at the root, and sidewall-doped piezoresistors were utilised to detect the in-plane deformation. There was a vertical notch at the root of the remaining two beams and a surface-doping piezoresistor in one beam to detect the out-of-plane deformation. Thus, the proposed sensor probe measures the three directional forces applied to the cantilever tip with high sensitivity and stiffness owing to the corresponding piezoresistive notch structures. We demonstrate a fabrication process that forms the notch structure and the surface and sidewall doping methods. Our fabricated device was confirmed capable of measuring triaxial forces with a force resolution at the sub-micro-Newton level.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.