一种用于探测接近导体的并联环形电容式接近传感器

IF 1.6 4区 工程技术 Q3 INSTRUMENTS & INSTRUMENTATION
Yanyan Shi, Fenglan Huang, Meng Wang, Yongheng Li
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引用次数: 0

摘要

为了解决传统电容式接近传感器灵敏度低的问题,提出了一种新型的电容式接近传感器。设计了五种不同结构的电容式接近传感器,并与传统电容式传感器进行了性能比较。研究了几何参数对电容式传感器性能的影响。此外,还讨论了所提出的电容式传感器对接近的不同尺寸导体的灵敏度。同时,分析了所设计的电容式传感器如何对接近物体的横向位置敏感。结果设计并分析了几种电容式接近传感器结构。研究发现,上小环-下大环结构的电容式传感器在上电极周围具有更强的电场分布,对接近导体的灵敏度高于其他传感器。通过对所提出传感器的进一步分析,结果表明所提出的电容式传感器对近距离目标检测是有效的。提出了一种上小环下大环结构的电容式接近传感器。与传统的电容式传感器相比,所提出的电容式传感器对接近的物体更加敏感。这将有助于准确探测接近的物体。此外,顶部和底部电极也小得多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A parallel ring-ring capacitive proximity sensor for detection of approaching conductor
Purpose To solve the problem of low sensitivity of traditional capacitive proximity sensor, this paper aims to propose a novel capacitive sensor for detection of an approaching conductor. Design/methodology/approach Five capacitive proximity sensors with different structures are designed and the performance is compared with the traditional capacitive sensor. The impacts of geometrical parameters on the performance of the proposed capacitive sensor are studied. Furthermore, the sensitivity of the proposed capacitive sensor to an approaching conductor with different sizes is discussed. Also, how the designed capacitive sensor is sensitive to the lateral placement of the approaching object is analyzed. Findings Several capacitive proximity sensor structures have been designed and analyzed. It is found that the capacitive sensor with the top small ring-bottom large ring structure shows stronger electric field distribution around the top electrode and higher sensitivity to the approaching conductor than other sensors. Through further analysis of the proposed sensor, the results demonstrate that proposed capacitive sensor is effective for proximity object detection. Originality/value This paper proposes a novel capacitive proximity sensor with top small ring-bottom large ring structure. Compared with the traditional capacitive sensor, the proposed capacitive sensor is more sensitive to the approaching object. This would be helpful for the accurate detection of the approaching object. Also, the top and bottom electrodes are much smaller.
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来源期刊
Sensor Review
Sensor Review 工程技术-仪器仪表
CiteScore
3.40
自引率
6.20%
发文量
50
审稿时长
3.7 months
期刊介绍: Sensor Review publishes peer reviewed state-of-the-art articles and specially commissioned technology reviews. Each issue of this multidisciplinary journal includes high quality original content covering all aspects of sensors and their applications, and reflecting the most interesting and strategically important research and development activities from around the world. Because of this, readers can stay at the very forefront of high technology sensor developments. Emphasis is placed on detailed independent regular and review articles identifying the full range of sensors currently available for specific applications, as well as highlighting those areas of technology showing great potential for the future. The journal encourages authors to consider the practical and social implications of their articles. All articles undergo a rigorous double-blind peer review process which involves an initial assessment of suitability of an article for the journal followed by sending it to, at least two reviewers in the field if deemed suitable. Sensor Review’s coverage includes, but is not restricted to: Mechanical sensors – position, displacement, proximity, velocity, acceleration, vibration, force, torque, pressure, and flow sensors Electric and magnetic sensors – resistance, inductive, capacitive, piezoelectric, eddy-current, electromagnetic, photoelectric, and thermoelectric sensors Temperature sensors, infrared sensors, humidity sensors Optical, electro-optical and fibre-optic sensors and systems, photonic sensors Biosensors, wearable and implantable sensors and systems, immunosensors Gas and chemical sensors and systems, polymer sensors Acoustic and ultrasonic sensors Haptic sensors and devices Smart and intelligent sensors and systems Nanosensors, NEMS, MEMS, and BioMEMS Quantum sensors Sensor systems: sensor data fusion, signals, processing and interfacing, signal conditioning.
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