硅晶片由类玻璃溶胶-凝胶键合形成纳米复合材料

Vescì Nacyânalʹnaj akadèmìì navuk Belarusì Pub Date : 2023-10-03 DOI:10.29235/1561-2430-2023-59-3-233-240

V. E. Gaishun, Ya. A. Kosenok, V. V. Vaskevich, O. I. Tyulenkova, V. E. Borisenko, N. S. Kovalchuk, A. N. Pyatlitski, S. V. Chumak

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引用次数: 0

摘要

我们在此开发了一种玻璃形成组合物和相关的溶胶-凝胶技术，用于粘合单晶硅片以生产“硅-绝缘体-硅”结构。在退火温度降至1000-1100℃的条件下，有可能制造出无缺陷的类玻璃键合层。溶胶-凝胶法制备的复合材料可用于硅片固体化合物的制备工艺。

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Silicon wafer bonding by the glass-like sol-gel formed nanocomposite

We have herein developed a glass-forming composition and the related sol-gel technology for bonding monocrystalline silicon wafers to produce «silicon–insulator–silicon» structures. A possibility to fabricate defect-free glass-like bonding layers at the annealing temperature decreased to 1000–1100 °C is demonstrated. The composites obtained by the sol-gel method can be used in technological processes of formation of the solid compound of silicon wafers.

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Vescì Nacyânalʹnaj akadèmìì navuk Belarusì

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