一种带小通道散热片的CPU散热器设计其热分析

IF 0.7 4区 工程技术 Q4 CHEMISTRY, APPLIED
Mehmet Emin Arzutuğ
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引用次数: 0

摘要

本文介绍了一种结合强旋流、微通道翅片和CuO纳米流体优点的三层微处理器冷却器的设计和热分析。本文的研究结果有助于理解微处理器温度下,微通道内雷诺数和CuO %体积分数等参数对散热器冷却通量的影响。结果表明:水- cuo - eg纳米流体混合冷却散热器的总性能随着Re数的增加和冷却剂中纳米颗粒负载百分比的增加而提高。从微处理器中提取的能量比最大CuO负载和Re数条件下产生的能量高241倍。此外,在最大CuO负荷值和最大Re数处测得的温度降幅最大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
Abstract In this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the cooling flux of the heat sink and the decline at the microprocessor temperature, as Reynolds number in the minichannels and CuO % volume fraction. The results have exhibited that the total performance of the heat sink cooled with the mixture of water–CuO-EG nanofluids increases with the increase of Re number and the %load of nanoparticles in the coolant. It has been determined that the energy withdrawn from the microprocessor was 241 times higher than the energy generated for maximum CuO load and Re number conditions. Besides, the highest temperature decrease has been measured at the maximum CuO load value and maximum Re number.
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来源期刊
Polish Journal of Chemical Technology
Polish Journal of Chemical Technology CHEMISTRY, APPLIED-ENGINEERING, CHEMICAL
CiteScore
1.70
自引率
10.00%
发文量
22
审稿时长
4.5 months
期刊介绍: Polish Journal of Chemical Technology is a peer-reviewed, international journal devoted to fundamental and applied chemistry, as well as chemical engineering and biotechnology research. It has a very broad scope but favors interdisciplinary research that bring chemical technology together with other disciplines. All authors receive very fast and comprehensive peer-review. Additionally, every published article is promoted to researchers working in the same field.
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