一种用于MEMS振荡器的高精度CMOS温度传感器

IF 0.8 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiwei Huang, Xiaodong Zheng, Xiaojie Guo, Jing Jin, Haoyu Liu
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引用次数: 0

摘要

本文提出了一种高精度、低功耗的CMOS温度-数字转换器(TDC),用于检测MEMS参考频率源的片上温度。该TDC使用双极晶体管作为温度测量的核心器件,并使用二阶Sigma-Delta ADC读取温度信息。为了提高精度,温度前端电路分别采用有限电流增益补偿电阻的PTAT偏置电路和Bank-Swap结构的动态元件匹配电路。在ADC设计中,采用互补结构的模拟T开关(AT-Switch)减小全差分开关电容积分器中MOS开关的漏电流,进一步提高精度。采用台积电180nm CMOS实现,TDC占地0.135mm2。测量结果表明,在1.8V电源电压下,电路的平均功耗为95µW(@27°C)。温度曲线拟合后,在-40℃~ 85℃范围内误差为±0.85℃(3σ),满足FBAR(film Bulk acoustic wave Resonator)振荡器的温度补偿要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A high precision CMOS temperature sensor for MEMS oscillator
This paper presents a high-precision, low-power CMOS temperature-to-digital converter (TDC) for detecting MEMS reference frequency sources on-chip temperature. This TDC uses a bipolar transistor as the core device for temperature measurement and a second-order Sigma-Delta ADC to read the temperature information. In order to improve the accuracy, the PTAT bias circuit with finite current gain compensation resistor and Dynamic Element Matching (DEM) circuit with Bank-Swap structure is employed in the temperature front-end circuit, respectively. In the ADC design, Analog T- switches (AT-Switch) with complementary structures are employed to reduce the leakage current of MOS switches in a fully differential switched-capacitor integrator to improve the accuracy further. Implemented in TSMC 180nm CMOS, the TDC occupies 0.135mm2. The measurement results show that the average power consumption of the circuit is 95µW (@27°C) at a supply voltage of 1.8V. After temperature curve fitting, an inaccuracy of ±0.85°C(3σ) is achieved from -40°C to 85°C, which meets the requirements of the FBAR(Flim Bulk Acoustic-wave Resonator) oscillator for temperature compensation.
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来源期刊
Ieice Electronics Express
Ieice Electronics Express 工程技术-工程:电子与电气
CiteScore
1.50
自引率
37.50%
发文量
119
审稿时长
1.1 months
期刊介绍: An aim of ELEX is rapid publication of original, peer-reviewed short papers that treat the field of modern electronics and electrical engineering. The boundaries of acceptable fields are not strictly delimited and they are flexibly varied to reflect trends of the fields. The scope of ELEX has mainly been focused on device and circuit technologies. Current appropriate topics include: - Integrated optoelectronics (lasers and optoelectronic devices, silicon photonics, planar lightwave circuits, polymer optical circuits, etc.) - Optical hardware (fiber optics, microwave photonics, optical interconnects, photonic signal processing, photonic integration and modules, optical sensing, etc.) - Electromagnetic theory - Microwave and millimeter-wave devices, circuits, and modules - THz devices, circuits and modules - Electron devices, circuits and modules (silicon, compound semiconductor, organic and novel materials) - Integrated circuits (memory, logic, analog, RF, sensor) - Power devices and circuits - Micro- or nano-electromechanical systems - Circuits and modules for storage - Superconducting electronics - Energy harvesting devices, circuits and modules - Circuits and modules for electronic displays - Circuits and modules for electronic instrumentation - Devices, circuits and modules for IoT and biomedical applications
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