用于人机交互的高灵敏度可扩展微球柔性压力传感器

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ye Wang, Shengshun Duan, Jiachen Liu, Fangzhi Zhao, Pinzhen Chen, Qiongfeng Shi, Jun Wu
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引用次数: 0

摘要

柔性微结构压力传感器(fmps)以其可靠性好、制作简单、灵敏度高等特点,广泛应用于健康监测、人机交互、电子皮肤等领域。虽然微结构传感层的使用提高了传感器的灵敏度,但也导致传感器的敏感压力范围有限,响应速度慢,循环稳定性差,这使得传感器无法在需要大检测范围、实时响应和高耐用性的应用中得到应用。在此,我们提出了一种先进的微结构传感层,通过在丝网印刷炭黑(CB)浆料中掺杂热膨胀微球(EP)来提高其力学性能。然后基于这种增强的微结构传感层开发了FMPS。得益于扩展的微球样微观结构,所制备的传感器具有高灵敏度(37.16 kPa-1),快速响应/恢复时间(126 / 52 ms)和良好的机械稳定性(超过3000次循环)。此外,构建了一个由机械臂、压力传感器、MEGA2560微控制器(MCU)和计算机组成的国产有效避碰系统,表明该传感器具有出色的触觉感知特性,使其成为人机协作(HRC)等智能机器人应用的有希望的候选对象。此外,我们开发了一种压力传感器阵列,并展示了其空间压力分布感知能力。所研制的基于微球的压力传感器及其阵列在仿人机器人、智能家居、人机交互等各种监测和交互应用中具有很大的应用潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly-sensitive expandable microsphere-based flexible pressure sensor for human-machine interaction
Abstract Flexible microstructural pressure sensors (FMPSs) have been widely used in different areas including health monitoring, human-machine interaction and electronic skin for their good reliability, easy fabrication, and highly sensitive sensing performance. Although the use of a sensing layer with microstructure improves the sensor sensitivity, it also results in limited sensitive pressure range, slow response and poor cyclic stability, which prevents the sensors from being utilized in applications requiring wide detect range, real-time response and high durability. Here, we propose an advanced micro-structured sensing layer through doping thermally expandable microspheres (EP) into the screen-printing carbon black (CB) slurry to enhance its mechanical properties. An FMPS is then developed based on this enhanced micro-structured sensing layer. Benefiting from the expanded microsphere-like microstructure, the as-prepared sensor features high sensitivity (37.16 kPa-1), fast response/recovery time (126 / 52 ms), and good mechanical stability (over 3000 cycles). In addition, a home-made and effective collision avoidance system consisting of a robotic arm, the pressure sensor, a MEGA2560 microcontroller unit (MCU) and a computer is constructed to indicate the sensor’s outstanding tactile perception characteristic, making it a promising candidate for intelligent robotic applications such as human-robot collaboration (HRC). Furthermore, we develop a pressure sensor array and demonstrate its ability to spatial pressure distribution perception. The developed microsphere-based pressure sensor and its array show great potential to be adopted in various monitoring and interactive applications such as humanoid robots, smart home, human-machine interaction, etc.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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