{"title":"测量热迁移","authors":"Michael Schirber","doi":"10.1103/physics.16.157","DOIUrl":null,"url":null,"abstract":"I n cell phones and other devices, a large temperature difference across a microcircuit can cause atoms to migrate, eventually resulting in faulty electrical connections. This so-called thermomigration has now been tracked at the microscale, revealing a diffusion-related force that drives the motion [1]. The researchers studied shallow depressions, or “basins,” on the surface of a square silicon wafer that was heated on one edge and cooled on the opposite edge. They","PeriodicalId":20136,"journal":{"name":"Physics","volume":"75 1","pages":"0"},"PeriodicalIF":1.5000,"publicationDate":"2023-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Measuring Thermal Migration\",\"authors\":\"Michael Schirber\",\"doi\":\"10.1103/physics.16.157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"I n cell phones and other devices, a large temperature difference across a microcircuit can cause atoms to migrate, eventually resulting in faulty electrical connections. This so-called thermomigration has now been tracked at the microscale, revealing a diffusion-related force that drives the motion [1]. The researchers studied shallow depressions, or “basins,” on the surface of a square silicon wafer that was heated on one edge and cooled on the opposite edge. They\",\"PeriodicalId\":20136,\"journal\":{\"name\":\"Physics\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":1.5000,\"publicationDate\":\"2023-09-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Physics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1103/physics.16.157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"PHYSICS, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1103/physics.16.157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
I n cell phones and other devices, a large temperature difference across a microcircuit can cause atoms to migrate, eventually resulting in faulty electrical connections. This so-called thermomigration has now been tracked at the microscale, revealing a diffusion-related force that drives the motion [1]. The researchers studied shallow depressions, or “basins,” on the surface of a square silicon wafer that was heated on one edge and cooled on the opposite edge. They