Samuel Tomlinson, Michael D. Mayer, Toby Kirk, Marc Hodes, Demetrios Papageorgiou
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Thermal Resistance Of Heated Superhydrophobic Channels with Streamwise Thermocapillary Stress
Abstract A pressure-driven channel flow between a longitudinally ridged superhydrophobic surface (SHS) and solid wall is studied, where a constant heat flux enters the channel from either the SHS or solid wall. First, a model is developed which neglects thermocapillary stresses (TCS) in the transverse direction. The caloric, convective, and total thermal resistance are evaluated, and their dependence on the shape of the liquid–gas interface (meniscus), gas ridge width, texture period, channel height, streamwise TCS, Péclet number, and channel length is established. The caloric resistance is minimized with menisci that protrude into the gas cavity, large slip fractions, small channel heights, and small streamwise TCSs. When heating from the SHS, the convective resistance increases, and therefore, a design compromise exists between caloric and convective resistances. However, when heating from the solid wall, the convective resistance remains the same and SHSs that minimize caloric resistance are optimal. We investigate both water and Galinstan for microchannel applications and find that both configurations can have a lower total thermal resistance than a smooth-walled channel. Heating from the solid wall is shown to always have the lowest total thermal resistance. Numerical simulations are used to analyze the effect of transverse TCSs. Our model captures much of the physics in heated superhydrophobic channels but is computationally inexpensive when compared to the numerical simulations.
期刊介绍:
Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.