29‐3:探讨GaN对GaN同外延微led的温度依赖性

Zichun Li, Yibo Liu, Feng Feng, Mengyuan Zhanghu, Hoi Sing Kwok, Zhaojun Liu
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引用次数: 0

摘要

在这项研究中,我们探索了在GaN衬底上具有不同像素尺寸的微型led的电特性,证明了小尺寸由于优越的电流扩散而具有高电流密度。由于对电极欧姆接触的温度依赖性,这是由TLM测量支持的,理想因子随着温度的升高而下降。我们还展示了在一定电流密度下,温度灵敏度与器件尺寸成正比,这很容易受到表面缺陷引起的载流子非辐射复合的影响。我们全面介绍了GaN - on - GaN同外延微led的热特性,为提高器件的稳定性和可靠性奠定了基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
29‐3: Exploring the Temperature Dependence of GaN‐on‐GaN Homoepitaxy Micro‐LEDs
In this study, we explored the electrical characteristics of micro‐LEDs with various pixel sizes on GaN substrates, demonstrating that small sizes have high current density due to superior current spreading. Due to the p‐electrode ohmic contact's temperature dependence, which is supported by TLM measurements, the ideal factor declines as temperature rises. We also show the temperature sensitivity in proportion to device size at a certain current density, which is susceptible to carrier non‐radiative recombination brought on by surface defects. We comprehensively present the thermal properties of GaN‐on‐GaN homoepitaxy micro‐LEDs, laying the groundwork for improved device stability and reliability.
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