基于不同PCB工艺的接地共面波导结构实验分析及不确定度分析

IF 0.8 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Ieice Electronics Express Pub Date : 2023-11-10 DOI:10.1587/elex.20.20230381

Hiroaki Takahashi, Ziad Hatab, Erich Schlaffer, Helmut Paulitsch, Wolfgang Bösch

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引用次数: 0

摘要

本文采用不确定度分析方法对接地共面波导进行了实验表征。所分析的GCPW线采用不同的减色法印刷电路板(PCB)制造工艺:面板镀法和图案镀法。采用改进的多线法，通过不确定传播分析提取了传播常数。这考虑了仪表噪声、长度不确定性以及由于每个制造过程的制造能力而导致的横截面变化所引起的阻抗不匹配。通过对传播常数的重新表述，我们得到了单位长度衰减和有效相对介电常数随频率变化的函数，频率最高可达43.5GHz，置信区间为95%。这些结果显示了与全波模拟的良好一致性，并突出了PCB制造工艺之间的差异。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

This paper presents an experimental characterization of grounded coplanar waveguides (GCPWs) with uncertainty analysis. GCPW lines to be analyzed were fabricated using different subtractive printed circuit board (PCB) manufacturing processes: panel plating method and pattern plating method. Using a modified multiline method, we have extracted the propagation constants with uncertainty propagation analysis. This considered instrumentation noise, length uncertainty, and impedance mismatch caused by variations in cross-section due to the fabrication capabilities of each manufacturing process. By reformulating the propagation constant, we obtained the attenuation per unit length and the effective relative permittivity as a function of frequencies up to 43.5GHz with 95% confidence interval. These results showed good agreement with full-wave simulations and highlighted the differences between the PCB manufacturing processes.

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来源期刊

Ieice Electronics Express 工程技术-工程：电子与电气

CiteScore

1.50

自引率

37.50%

发文量

119

审稿时长

1.1 months

期刊介绍： An aim of ELEX is rapid publication of original, peer-reviewed short papers that treat the field of modern electronics and electrical engineering. The boundaries of acceptable fields are not strictly delimited and they are flexibly varied to reflect trends of the fields. The scope of ELEX has mainly been focused on device and circuit technologies. Current appropriate topics include: - Integrated optoelectronics (lasers and optoelectronic devices, silicon photonics, planar lightwave circuits, polymer optical circuits, etc.) - Optical hardware (fiber optics, microwave photonics, optical interconnects, photonic signal processing, photonic integration and modules, optical sensing, etc.) - Electromagnetic theory - Microwave and millimeter-wave devices, circuits, and modules - THz devices, circuits and modules - Electron devices, circuits and modules (silicon, compound semiconductor, organic and novel materials) - Integrated circuits (memory, logic, analog, RF, sensor) - Power devices and circuits - Micro- or nano-electromechanical systems - Circuits and modules for storage - Superconducting electronics - Energy harvesting devices, circuits and modules - Circuits and modules for electronic displays - Circuits and modules for electronic instrumentation - Devices, circuits and modules for IoT and biomedical applications