IEEE智慧村

{"title":"IEEE智慧村","authors":"","doi":"10.1109/mias.2023.3315765","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":50390,"journal":{"name":"IEEE Industry Applications Magazine","volume":"178 ","pages":"0"},"PeriodicalIF":0.7000,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"IEEE smart village\",\"authors\":\"\",\"doi\":\"10.1109/mias.2023.3315765\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":50390,\"journal\":{\"name\":\"IEEE Industry Applications Magazine\",\"volume\":\"178 \",\"pages\":\"0\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2023-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Industry Applications Magazine\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/mias.2023.3315765\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Industry Applications Magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/mias.2023.3315765","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}