M.G. Kang, D.H. Kim, D.I. Jang, H. Lee, R.S. Myong
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THERMAL FLOW FIELD ANALYSIS OF HEAT SINK FOR IMPROVING COOLING EFFICIENCY OF AVIONICS EQUIPMENT
The amount of heat generated by avionics equipment in aircraft increases as more electrical components become compact. Avionics directly affects airplane performance, and thermal management systems play an important role in maintaining safety and performance. In this study, thermal analysis of avionics equipment mounted on aircraft was conducted to improve performance by considering shape modification and fan operation. A temperature difference of up to 55°C was observed for the basic shape when the fan was not operated. Several attempts such as the change of shape and material were made, but it was observed that the devices reached an excessive temperature. It was shown that the devices reached the proper level of temperature where forced convection was imposed by operating the fan. This study will provide critical information for the development of improved cooling methods for avionics and derivation of environmental conditions.
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