{"title":"高精度绝缘栅双极晶体管短路运算电路仿真方法","authors":"Takaya Ozawa, Takao Yamamoto, Hiroto Sugiura, Yosuke Kondo","doi":"10.1541/ieejjia.21009050","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a novel method to improve the circuit simulation accuracy of insulated-gate bipolar transistor (IGBT) power devices under a short-circuit state. To determine the IGBT junction temperature, the transient thermal resistance of an IGBT device on the order of micro seconds is estimated by transient thermal simulations. The saturation current without self-heating effects is estimated based on a short-circuit test and the transient thermal resistance. The IGBT SPICE parameter is extracted from the saturation current characteristics during the short-circuit state. The coupled electrical-thermal simulations with the SPICE model and thermal resistance model are applied to several short-circuit evaluations with different parasitic impedance and gate driving condition, and the results are consistent with the measured current and voltage waveforms.","PeriodicalId":45552,"journal":{"name":"IEEJ Journal of Industry Applications","volume":"16 1","pages":"0"},"PeriodicalIF":1.0000,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Circuit Simulation Method for Insulated-Gate Bipolar Transistor Short-Circuit Operation with High Accuracy\",\"authors\":\"Takaya Ozawa, Takao Yamamoto, Hiroto Sugiura, Yosuke Kondo\",\"doi\":\"10.1541/ieejjia.21009050\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose a novel method to improve the circuit simulation accuracy of insulated-gate bipolar transistor (IGBT) power devices under a short-circuit state. To determine the IGBT junction temperature, the transient thermal resistance of an IGBT device on the order of micro seconds is estimated by transient thermal simulations. The saturation current without self-heating effects is estimated based on a short-circuit test and the transient thermal resistance. The IGBT SPICE parameter is extracted from the saturation current characteristics during the short-circuit state. The coupled electrical-thermal simulations with the SPICE model and thermal resistance model are applied to several short-circuit evaluations with different parasitic impedance and gate driving condition, and the results are consistent with the measured current and voltage waveforms.\",\"PeriodicalId\":45552,\"journal\":{\"name\":\"IEEJ Journal of Industry Applications\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2023-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEJ Journal of Industry Applications\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1541/ieejjia.21009050\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEJ Journal of Industry Applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1541/ieejjia.21009050","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Circuit Simulation Method for Insulated-Gate Bipolar Transistor Short-Circuit Operation with High Accuracy
In this paper, we propose a novel method to improve the circuit simulation accuracy of insulated-gate bipolar transistor (IGBT) power devices under a short-circuit state. To determine the IGBT junction temperature, the transient thermal resistance of an IGBT device on the order of micro seconds is estimated by transient thermal simulations. The saturation current without self-heating effects is estimated based on a short-circuit test and the transient thermal resistance. The IGBT SPICE parameter is extracted from the saturation current characteristics during the short-circuit state. The coupled electrical-thermal simulations with the SPICE model and thermal resistance model are applied to several short-circuit evaluations with different parasitic impedance and gate driving condition, and the results are consistent with the measured current and voltage waveforms.
期刊介绍:
IEEJ Journal of Industry Applications: Power Electronics - AC/AC Conversion and DC/DC Conversion, - Power Semiconductor Devices and their Application, - Inverters and Rectifiers, - Power Supply System and its Application, - Power Electronics Modeling, Simulation, Design and Control, - Renewable Electric Energy Conversion Industrial System - Mechatronics and Robotics, - Industrial Instrumentation and Control, - Sensing, Actuation, Motion Control and Haptics, - Factory Automation and Production Facility Control, - Automobile Technology and ITS Technology, - Information Oriented Industrial System Electrical Machinery and Apparatus - Electric Machines Design, Modeling and Control, - Rotating Motor Drives and Linear Motor Drives, - Electric Vehicles and Hybrid Electric Vehicles, - Electric Railway and Traction Control, - Magnetic Levitation and Magnetic Bearing, - Static Apparatus and Superconductive Application Publishing Ethics of IEEJ Journal of Industry Applications: Code of Ethics on IEEJ IEEJ Journal of Industry Applications is a peer-reviewed journal of IEEJ (the Institute of Electrical Engineers of Japan). The publication of IEEJ Journal of Industry Applications is an essential building article in the development of a coherent and respected network of knowledge. It is a direct reflection of the quality of the work of the authors and the institutions that support them. IEEJ Journal of Industry Applications has "Peer-reviewed articles support." It is therefore important to agree upon standards of expected ethical behavior for all parties involved in the act of publishing: the author, the journal editor, the peer reviewer and IEEJ (the Institute of Electrical Engineers of Japan).