N. Discharoen, S. Sanorpim, N. Nuntawong, V. Yordsri, K. Onabe
{"title":"PAMBE用TEM研究MgO(001)衬底上立方氮化镓沿[100]带轴的堆积缺陷","authors":"N. Discharoen, S. Sanorpim, N. Nuntawong, V. Yordsri, K. Onabe","doi":"10.1080/10584587.2023.2227049","DOIUrl":null,"url":null,"abstract":"AbstractMicrostructures of cubic AlN on MgO (001) with using two-step growth of cubic GaN buffer layer grown by plasma assist molecular beam epitaxy (PAMBE) technique have been investigated by bright- and dark field cross section transmission electron microscopy (TEM) along [100] zone axis. The Pyramid shape contrast which has been proposed the characteristic of stacking faults defect was observed in cubic AlN film. Pyramid facet contrast correspond with (002) plane and (111) plane with ∼45° projection along [100] direction. The 3D graphic model can explain the Pyramid contrast structure defect as the same Pyramid contrast structure observed in [110] direction with the angle between (002) and (111) of cubic structure found ∼54.7° by the literature.Keywords: Cubic phaseAlNbuffer layerMBEstacking faultTEM AcknowledgementsThe authors would like to thank the 90th Anniversary of Chulalongkorn University Fund (Ratchadaphiseksomphot Endowment Fund), Conference Grant for Ph.D. Student Chulalongkorn University and Ratchadaphiseksomphot Endowment Fund of Chulalongkorn University (RES5605302227AM) for their financial support.Disclosure StatementNo potential conflict of interest was reported by the authors.","PeriodicalId":13686,"journal":{"name":"Integrated Ferroelectrics","volume":"47 1","pages":"0"},"PeriodicalIF":0.7000,"publicationDate":"2023-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"TEM Investigation of Stacking Faults Defect Taken Along [100] Zone Axis of Cubic AlN on MgO (001) Substrate with Using 2-Step Growth Cubic GaN Buffer Layer by PAMBE\",\"authors\":\"N. Discharoen, S. Sanorpim, N. Nuntawong, V. Yordsri, K. Onabe\",\"doi\":\"10.1080/10584587.2023.2227049\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AbstractMicrostructures of cubic AlN on MgO (001) with using two-step growth of cubic GaN buffer layer grown by plasma assist molecular beam epitaxy (PAMBE) technique have been investigated by bright- and dark field cross section transmission electron microscopy (TEM) along [100] zone axis. The Pyramid shape contrast which has been proposed the characteristic of stacking faults defect was observed in cubic AlN film. Pyramid facet contrast correspond with (002) plane and (111) plane with ∼45° projection along [100] direction. The 3D graphic model can explain the Pyramid contrast structure defect as the same Pyramid contrast structure observed in [110] direction with the angle between (002) and (111) of cubic structure found ∼54.7° by the literature.Keywords: Cubic phaseAlNbuffer layerMBEstacking faultTEM AcknowledgementsThe authors would like to thank the 90th Anniversary of Chulalongkorn University Fund (Ratchadaphiseksomphot Endowment Fund), Conference Grant for Ph.D. Student Chulalongkorn University and Ratchadaphiseksomphot Endowment Fund of Chulalongkorn University (RES5605302227AM) for their financial support.Disclosure StatementNo potential conflict of interest was reported by the authors.\",\"PeriodicalId\":13686,\"journal\":{\"name\":\"Integrated Ferroelectrics\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2023-09-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Integrated Ferroelectrics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/10584587.2023.2227049\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Integrated Ferroelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/10584587.2023.2227049","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
TEM Investigation of Stacking Faults Defect Taken Along [100] Zone Axis of Cubic AlN on MgO (001) Substrate with Using 2-Step Growth Cubic GaN Buffer Layer by PAMBE
AbstractMicrostructures of cubic AlN on MgO (001) with using two-step growth of cubic GaN buffer layer grown by plasma assist molecular beam epitaxy (PAMBE) technique have been investigated by bright- and dark field cross section transmission electron microscopy (TEM) along [100] zone axis. The Pyramid shape contrast which has been proposed the characteristic of stacking faults defect was observed in cubic AlN film. Pyramid facet contrast correspond with (002) plane and (111) plane with ∼45° projection along [100] direction. The 3D graphic model can explain the Pyramid contrast structure defect as the same Pyramid contrast structure observed in [110] direction with the angle between (002) and (111) of cubic structure found ∼54.7° by the literature.Keywords: Cubic phaseAlNbuffer layerMBEstacking faultTEM AcknowledgementsThe authors would like to thank the 90th Anniversary of Chulalongkorn University Fund (Ratchadaphiseksomphot Endowment Fund), Conference Grant for Ph.D. Student Chulalongkorn University and Ratchadaphiseksomphot Endowment Fund of Chulalongkorn University (RES5605302227AM) for their financial support.Disclosure StatementNo potential conflict of interest was reported by the authors.
期刊介绍:
Integrated Ferroelectrics provides an international, interdisciplinary forum for electronic engineers and physicists as well as process and systems engineers, ceramicists, and chemists who are involved in research, design, development, manufacturing and utilization of integrated ferroelectric devices. Such devices unite ferroelectric films and semiconductor integrated circuit chips. The result is a new family of electronic devices, which combine the unique nonvolatile memory, pyroelectric, piezoelectric, photorefractive, radiation-hard, acoustic and/or dielectric properties of ferroelectric materials with the dynamic memory, logic and/or amplification properties and miniaturization and low-cost advantages of semiconductor i.c. technology.